SNVU894 December   2024 LM5169

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General TI High Voltage Evaluation User Safety Guidelines
  8. 2Hardware
    1. 2.1 Quick Start Procedure
    2. 2.2 Detailed Descriptions
      1. 2.2.1 Compatibility With the LM5017
  9. 3Implementation Results
    1. 3.1 Performance Curves
    2. 3.2 EVM Characteristics
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

4.2 PCB Layout

Figure 4-2 through Figure 4-5 show the board layout for the LM5169FEVM.

The 8-pin NGU PowerPAD™ package offers an exposed thermal pad, which must be soldered to the copper landing on the PCB for excellent thermal performance. The PCB consists of a 4-layer design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal vias under the thermal pad to connect to all four layers.

LM5169FEVM Top Layer Figure 4-2 Top Layer
LM5169FEVM Mid-Layer 1 Ground Plane Figure 4-3 Mid-Layer 1 Ground Plane
LM5169FEVM Mid-Layer 2 Routing Figure 4-4 Mid-Layer 2 Routing
LM5169FEVM Bottom Layer Figure 4-5 Bottom Layer