SNVU915 August 2024 LMG2100R026
This section describes the EVM hardware and outlines the procedure to set up for evaluation. Figure 3-1 and Figure 3-2 show the top and bottom views of the LMG21EVM-097, respectively.
The EVM can be mounted with a heat sink (S05MZZ37, 20mm x 35mm x 10mm) to improve the thermal performance. The two exposed thermal pads have a high-voltage potential difference between them, therefore an electrically isolated thermal interface material (TIM) is used. TIM of GR80A-0H-50GY (thermal conductivity of 8W/mK and thickness of 0.5mm) has been placed between the device and the heat sink.