SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

 

  1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
    1.     Trademarks
    2. 1  Using This Guide
    3. 2  A Word of Caution
    4. 3  A Team Sport
    5. 4  Be Wary of Quotes
    6. 5  Don’t Forget Your CAD Tools
    7. 6  Metric Vs English
    8. 7  PCB Fab Limits
    9. 8  Routing and Layer Stackup
    10. 9  OMAP35x 0.4mm Pitch
    11. 10 Pad Type
    12. 11 PCB Pad Dimensions for 0.4mm BGA Package
    13. 12 Multiple BGA Packages
    14. 13 Etch Traps and Heat Sinks
    15. 14 Vias and VIP
    16. 15 Laser Blind Vias
    17. 16 Filled Vias
    18. 17 Know Your Tools
    19. 18 BeagleBoard
    20. 19 BeagleBoard Views
      1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
      2. 19.2 Layer 2 – Ground
      3. 19.3 Layer 3 – Signal
      4. 19.4 Layer 4 – Signal
      5. 19.5 Layer 5 – Power (VDD2)
      6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
    21. 20 OMAP35x Decoupling
    22. 21 PCB Finishes for High Density Interconnect (HDI)
    23. 22 Real World Second Opinion
    24. 23 Acknowledgments
    25. 24 References
  2.   Revision History

6 Metric Vs English

Here is one of the most common complaints about moving to fine-pitch BGA package design – use of the metric system. Most designers dislike this simply because all of their familiar rule-of-thumb guidelines are in the English system. Quick test, which is easier to understand 0.0033” or 83 μm? It is strongly suggested to set up your CAD grid in micrometers (μm) and do away with the four decimal places of accuracy needed to represent small features in the English system.