SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

 

  1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
    1.     Trademarks
    2. Using This Guide
    3. A Word of Caution
    4. A Team Sport
    5. Be Wary of Quotes
    6. Don’t Forget Your CAD Tools
    7. Metric Vs English
    8. PCB Fab Limits
    9. Routing and Layer Stackup
    10. OMAP35x 0.4mm Pitch
    11. 10 Pad Type
    12. 11 PCB Pad Dimensions for 0.4mm BGA Package
    13. 12 Multiple BGA Packages
    14. 13 Etch Traps and Heat Sinks
    15. 14 Vias and VIP
    16. 15 Laser Blind Vias
    17. 16 Filled Vias
    18. 17 Know Your Tools
    19. 18 BeagleBoard
    20. 19 BeagleBoard Views
      1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
      2. 19.2 Layer 2 – Ground
      3. 19.3 Layer 3 – Signal
      4. 19.4 Layer 4 – Signal
      5. 19.5 Layer 5 – Power (VDD2)
      6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
    21. 20 OMAP35x Decoupling
    22. 21 PCB Finishes for High Density Interconnect (HDI)
    23. 22 Real World Second Opinion
    24. 23 Acknowledgments
    25. 24 References
  2.   Revision History

OMAP35x Decoupling

There are a lot of power pins on the OMAP35x. Decoupling capacitors are required and must be placed as close to the ball connection as possible. When selecting a power and ground, choose the ground closest to the power pin for each decoupling capacitor. A single decoupling capacitor can serve up to three balls.

The BeagleBoard has almost all of its decoupling capacitors mounted on the bottom side of the board. Each capacitor connects with as many as three processor power pins through both blind vias to the power plane and thru-hole vias from top to bottom.

Figure 25 shows how the OMAP335xx’s VDD2 rail is decoupled on the BeagleBoard. The processor outline is shown as a dotted line and the PCB design is viewed from the top side. The schematic for this area is shown to the right and the reference designators are shown on the appropriate capacitors.

The bypass capacitors are 0.1μF, 10 V, X7R type and are in a 0402 package.

There are additional voltage rails that use the remaining capacitors. A careful study of the BeagleBoard Gerbers and schematics will help you as your design is realized and illustrate what worked for this board.

pcb_btm_praav1.gifFigure 25. BeagleBoard Bypass Group for VDD2