SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

 

  1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
    1.     Trademarks
    2. 1  Using This Guide
    3. 2  A Word of Caution
    4. 3  A Team Sport
    5. 4  Be Wary of Quotes
    6. 5  Don’t Forget Your CAD Tools
    7. 6  Metric Vs English
    8. 7  PCB Fab Limits
    9. 8  Routing and Layer Stackup
    10. 9  OMAP35x 0.4mm Pitch
    11. 10 Pad Type
    12. 11 PCB Pad Dimensions for 0.4mm BGA Package
    13. 12 Multiple BGA Packages
    14. 13 Etch Traps and Heat Sinks
    15. 14 Vias and VIP
    16. 15 Laser Blind Vias
    17. 16 Filled Vias
    18. 17 Know Your Tools
    19. 18 BeagleBoard
    20. 19 BeagleBoard Views
      1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
      2. 19.2 Layer 2 – Ground
      3. 19.3 Layer 3 – Signal
      4. 19.4 Layer 4 – Signal
      5. 19.5 Layer 5 – Power (VDD2)
      6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
    21. 20 OMAP35x Decoupling
    22. 21 PCB Finishes for High Density Interconnect (HDI)
    23. 22 Real World Second Opinion
    24. 23 Acknowledgments
    25. 24 References
  2.   Revision History

1 Using This Guide

This application report focuses on circuit board design guidelines specific to the OMAP35x processor, with 0.4mm pitch on the bottom and 0.5mm pitch pads on the top for memory attachment, using package-on-package technology. Experience has shown that PCB board design is the most crucial aspect of PoP design due to the extremely small pad pitches. Also, not all assembly houses can build such small pitch assemblies or properly mount the memory on top of the processor.

Figure 2 shows a 0.4mm pitch processor and its matching memory at 0.5mm pitch.

part1_praav1.gifFigure 2. Part 1 - Focus for Part I - PCB Design Guidelines

Guidelines for the assembly of PCBs that use the PoP package are covered in the companion article to this document, PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II, which will be referred to as Part II throughout the remainder of this document. Included are assembly options and suggestions to use when qualifying and working with your assembly sites, either internal or contract.

part2_praav1.gifFigure 3. Focus for Part II - Assembly Guidelines