SPRACP3C November   2019  – December 2021 AWR6843 , AWR6843AOP , IWR1443 , IWR1642 , IWR6443 , IWR6843 , IWR6843AOP

 

  1.   Trademarks
  2. 1Introduction
  3. 2Typical Certification Procedure
  4. 3Regulatory Compliance Overview
    1. 3.1 European Union Regulations - Radio Equipment directive (RED)
      1. 3.1.1 Efficient Use of the Radio Spectrum (EN 305 550)
      2. 3.1.2 RF Exposure Limit - EN 62311
      3. 3.1.3 Electrical Safety - EN 62368
      4. 3.1.4 ElectroMagnetic Compatibility (EMC) - EN 301 489-1
    2. 3.2 Federal Communications Commission (FCC)
      1. 3.2.1 End Equipment and FCC Clause
      2. 3.2.2 Fundamental Emmision levels
      3. 3.2.3 Spurious Emission
      4. 3.2.4 Frequency Stability
      5. 3.2.5 Radiation Exposure Requirement
      6. 3.2.6 FCC Waiver and Other Relevant Information
    3. 3.3 Applicable Terms and Equations
      1. 3.3.1 Duty Cycle Factor
      2. 3.3.2 Effective Isotropic Radiated Power (EIRP)
      3. 3.3.3 Friis Equation
      4. 3.3.4 Far-Field Boundary
  5. 4Tools and Setup
    1. 4.1 Hardware Setup
    2. 4.2 MMWAVESTUDIO
      1. 4.2.1 Running LUA Scripts
    3. 4.3 mmWave Visualizer
    4. 4.4 IWR6843ISK-ODS Test Case
  6. 5Common Issues and Resolutions
    1. 5.1 Peak Power
    2. 5.2 Occupied Bandwidth
    3. 5.3 Spurious Emissions
      1. 5.3.1 14.4-Ghz Harmonics
      2. 5.3.2 Suggested Resolution
        1. 5.3.2.1 Hardware Measures
        2. 5.3.2.2 Software Measures
    4. 5.4 Overshoot
    5. 5.5 Frequency Stability
      1. 5.5.1 Generating CW Signal
      2. 5.5.2 Frequency Stability Over Temperature and Voltage Range
  7. 6References
  8. 7Revision History

5.3.2.1 Hardware Measures

  • The shield or absorber should be placed as shown in Figure 5-3 and Figure 5-4.
  • Applicable mmwave devices, decoupliing caps, crystal, and the surrounding PCB area should be covered by shield or absorber.
  • The shield should be well grounded, covering the components of interest, and absorbers should be properly adhered to PCB and components of interest.
  • Ensure the height of the shield from the PCB is greater than or equals to 2mm above the RF traces; otherwise the RF transmission lines may couple with the shield and RF matching might get disturbed. Manufacturing tolerances, wear and tear, shield assembly, and so forth must be considered so that a 2-mm+ height from the board is always maintained.
  • When using an RF absorber, the antenna should not be covered; the absorber should be placed such that it does not go beyond the edge of the IC on the areas with the TX and RX traces
  • Example of an absorber used to suppress the emission is Cuming Microwave (GDX/PPGA 0.03").
GUID-5E174859-D7B9-4C7A-9378-0E69EE224385-low.png
All RF traces should be at least 2 mm away from shielding cover.
Figure 5-3 Shield Placement
GUID-26ADEB54-9C7D-4C24-8761-8F090C289392-low.png Figure 5-4 RF Absorber Placement