SPRUI30H November 2015 – May 2024 DRA745 , DRA746 , DRA750 , DRA756
Table 29-2 shows the device integrated PWMSS subsystems interface signals to external devices.
PWMSS Modules Level Signal Name | Device Level Signal Name | I/O Type(1) | Description | Module Pin Reset Value |
---|---|---|---|---|
PWMSS1 | ||||
EPWM1A | ehrpwm1A | O | PWM1 output A | 0 |
EPWM1B | ehrpwm1B | O | PWM1 output B | 0 |
EPWM1SYNCI | ehrpwm1_synci | I | PWM1 Sync input | HiZ |
EPWM1SYNCO | ehrpwm1_synco | O | PWM1 Sync output | 0 |
EPWM1_TRIP_TZ[0] | ehrpwm1_tripzone_input | I | PWM1 TripZone input | HiZ |
ECAP1_CAPIN_APWMOUT | eCAP1_in_PWM1_out | I/O | eCAP1 Capture input/PWM1 output | HiZ |
EQEP1_A | eQEP1A_in | I | eQEP1 Quadrature input | HiZ |
EQEP1_B | eQEP1B_in | I | eQEP1 Quadrature input | HiZ |
EQEP1_INDEX | eQEP1_index | I/O | eQEP1 Index input/output | HiZ |
EQEP1_STROBE | eQEP1_strobe | I/O | eQEP1 Strobe input/output | HiZ |
PWMSS2 | ||||
EPWM2A | ehrpwm2A | O | PWM2 output A | 0 |
EPWM2B | ehrpwm2B | O | PWM2 output B | 0 |
EPWM2_TRIP_TZ[0] | ehrpwm2_tripzone_input | I | PWM2 TripZone input | HiZ |
ECAP2_CAPIN_APWMOUT | eCAP2_in_PWM2_out | I/O | eCAP2 Capture input/PWM2 output | HiZ |
EQEP2_A | eQEP2A_in | I | eQEP2 Quadrature input | HiZ |
EQEP2_B | eQEP2B_in | I | eQEP2 Quadrature input | HiZ |
EQEP2_INDEX | eQEP2_index | I/O | eQEP2 Index input/output | HiZ |
EQEP2_STROBE | eQEP2_strobe | I/O | eQEP2 Strobe input/output | HiZ |
PWMSS3 | ||||
EPWM3A | ehrpwm3A | O | PWM3 output A | 0 |
EPWM3B | ehrpwm3B | O | PWM3 output B | 0 |
EPWM3_TRIP_TZ[0] | ehrpwm3_tripzone_input | I | PWM3 TripZone input | HiZ |
ECAP3_CAPIN_APWMOUT | eCAP3_in_PWM3_out | I/O | eCAP3 Capture input/PWM3 output | HiZ |
EQEP3_A | eQEP3A_in | I | eQEP3 Quadrature input | HiZ |
EQEP3_B | eQEP3B_in | I | eQEP3 Quadrature input | HiZ |
EQEP3_INDEX | eQEP3_index | I/O | eQEP3 Index input/output | HiZ |
EQEP3_STROBE | eQEP3_strobe | I/O | eQEP3 Strobe input/output | HiZ |
The PWMSSn (where n=1 to 3 synchronization I/O signals which are NOT available at chip pad level are as follows:
These signals are interconnected via a daisy chain implemented within the device. See also Section 29.1.3.1.2.
For more details on synchronization daisy-chain which exist between the PWMSS1, PWMSS2 and PWMSS3, refer to the Section 29.1.3.1.2 .
Figure 29-2 shows the external interface I/Os for the integrated modules in PWMSSn (where n=1 to 3) .
The path from module pin to device pad(s) is defined at the device I/O logic level. The I/O logic maps the module signals to the different pads of the device and is programmable in the Control Module registers. For more information, refer to the Pad Configuration Registers, in the chapter, Control Module.