SPRUI30H November 2015 – May 2024 DRA745 , DRA746 , DRA750 , DRA756
The L3_MAIN interconnect links cores in a flexible topology that couples low power with high performance. Innovative physical structures and advanced protocols ensure bandwidth and latency to individual IP cores, providing dedicated connections between IP cores and logical connections over a shared interconnect.
The main features of the L3_MAIN interconnects are:
Figure 14-2 shows an overview of the L3 interconnect and the peripherals attached to it.