SWCU193A April   2023  – August 2024 CC2340R2 , CC2340R5 , CC2340R5-Q1

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Devices
    3.     Register, Field, and Bit Calls
    4.     Related Documentation
    5.     Trademarks
  3. 1 Architectural Overview
    1. 1.1  Target Applications
    2. 1.2  Introduction
    3. 1.3  Arm Cortex M0+
      1. 1.3.1 Processor Core
      2. 1.3.2 SysTick Timer
      3. 1.3.3 Nested Vectored Interrupt Controller
      4. 1.3.4 System Control Block (SCB)
    4. 1.4  On-Chip Memory
      1. 1.4.1 SRAM
      2. 1.4.2 Flash
      3. 1.4.3 ROM
    5. 1.5  Power Supply System
      1. 1.5.1 VDDS
      2. 1.5.2 VDDR
      3. 1.5.3 VDDD Digital Core Supply
      4. 1.5.4 DC/DC Converter
    6. 1.6  Radio
    7. 1.7  AES 128-bit Cryptographic Accelerator
    8. 1.8  System Timer (SYSTIM)
    9. 1.9  General Purpose Timers (LGPT)
    10. 1.10 Always-ON (AON) or Ultra-Low Leakage (ULL) Domain
      1. 1.10.1 Watchdog Timer
      2. 1.10.2 Battery and Temperature Monitor
      3. 1.10.3 Real-time Clock (RTC)
      4. 1.10.4 Low Power Comparator
    11. 1.11 Direct Memory Access
    12. 1.12 System Control and Clock
    13. 1.13 Communication Peripherals
      1. 1.13.1 UART
      2. 1.13.2 I2C
      3. 1.13.3 SPI
    14. 1.14 Programmable I/Os
    15. 1.15 Serial Wire Debug (SWD)
  4. 2  Arm Cortex-M0+ Processor
    1. 2.1 Introduction
    2. 2.2 Block Diagram
    3. 2.3 Overview
      1. 2.3.1 Peripherals
      2. 2.3.2 Programmer's Model
      3. 2.3.3 Instruction Set Summary
      4. 2.3.4 Memory Model
    4. 2.4 Registers
      1. 2.4.1 BPU Registers
      2. 2.4.2 CPU_ROM_TABLE Registers
      3. 2.4.3 DCB Registers
      4. 2.4.4 SCB Registers
      5. 2.4.5 SCSCS Registers
      6. 2.4.6 NVIC Registers
      7. 2.4.7 SYSTICK Registers
  5. 3 Memory Map
    1. 3.1 Memory Map
  6. 4 Interrupts and Events
    1. 4.1 Exception Model
      1. 4.1.1 Exception States
      2. 4.1.2 Exception Types
      3. 4.1.3 Exception Handlers
      4. 4.1.4 Vector Table
      5. 4.1.5 Exception Priorities
      6. 4.1.6 Exception Entry and Return
        1. 4.1.6.1 Exception Entry
        2. 4.1.6.2 Exception Return
    2. 4.2 Fault Handling
      1. 4.2.1 Lockup
    3. 4.3 Event Fabric
      1. 4.3.1 Introduction
      2. 4.3.2 Overview
      3. 4.3.3 Registers
      4. 4.3.4 AON Event Fabric
        1. 4.3.4.1 AON Common Input Events List
        2. 4.3.4.2 AON Event Subscribers
        3. 4.3.4.3 Power Management Controller (PMCTL)
        4. 4.3.4.4 Real Time Clock (RTC)
        5. 4.3.4.5 AON to MCU Event Fabric
      5. 4.3.5 MCU Event Fabric
        1. 4.3.5.1 Common Input Event List
        2. 4.3.5.2 MCU Event Subscribers
          1. 4.3.5.2.1 System CPU
          2. 4.3.5.2.2 Non-Maskable Interrupt (NMI)
    4. 4.4 Digital Test Bus (DTB)
    5. 4.5 EVTULL Registers
    6. 4.6 EVTSVT Registers
  7. 5 Debug Subsystem
    1. 5.1  Introduction
    2. 5.2  Block Diagram
    3. 5.3  Overview
      1. 5.3.1 Physical Interface
      2. 5.3.2 Debug Access Ports
    4. 5.4  Debug Features
      1. 5.4.1 Processor Debug
      2. 5.4.2 Breakpoint Unit (BPU)
      3. 5.4.3 Peripheral Debug
    5. 5.5  Behavior in Low Power Modes
    6. 5.6  Restricting Debug Access
    7. 5.7  Mailbox (DSSM)
    8. 5.8  Mailbox Events
      1. 5.8.1 CPU Interrupt Event (AON_DBG_COMB)
    9. 5.9  Software Considerations
    10. 5.10 DBGSS Registers
  8. 6 Power, Reset, and Clocking
    1. 6.1  Introduction
    2. 6.2  System CPU Modes
    3. 6.3  Supply System
      1. 6.3.1 Internal DC/DC Converter and Global LDO
    4. 6.4  Power States
      1. 6.4.1 Reset
      2. 6.4.2 Shutdown
      3. 6.4.3 Active
      4. 6.4.4 Idle
      5. 6.4.5 Standby
    5. 6.5  Digital Power Partitioning
    6. 6.6  Clocks
      1. 6.6.1 CLKSVT
      2. 6.6.2 CLKULL
    7. 6.7  Resets
      1. 6.7.1 Watchdog Timer (WDT)
      2. 6.7.2 LF Loss Detection
    8. 6.8  AON (REG3V3) Register Bank
    9. 6.9  CKMD Registers
    10. 6.10 CLKCTL Registers
    11. 6.11 PMCTL Registers
  9. 7 Internal Memory
    1. 7.1 SRAM
    2. 7.2 VIMS
      1. 7.2.1 Introduction
      2. 7.2.2 Block Diagram
      3. 7.2.3 Cache
        1. 7.2.3.1 Basic Cache Mechanism
        2. 7.2.3.2 Cache Prefetch Mechanism
        3. 7.2.3.3 Cache Micro-Prediction Mechanism
      4. 7.2.4 Flash
        1. 7.2.4.1 Flash Read-Only Protection
        2. 7.2.4.2 Flash Memory Programming
      5. 7.2.5 ROM
    3. 7.3 VIMS Registers
    4. 7.4 FLASH Registers
  10. 8 Device Boot and Bootloader
    1. 8.1 Device Boot and Programming
      1. 8.1.1 Boot Flow
      2. 8.1.2 Boot Timing
      3. 8.1.3 Boot Status
      4. 8.1.4 Boot Protection/Locking Mechanisms
      5. 8.1.5 Debug and Active SWD Connections at Boot
      6. 8.1.6 Flashless Test Mode and Tools Client Mode
        1. 8.1.6.1 Flashless Test Mode
        2. 8.1.6.2 Tools Client Mode
      7. 8.1.7 Retest Mode and Return-to-Factory Procedure
      8. 8.1.8 Disabling SWD Debug Port
    2. 8.2 Flash Programming
      1. 8.2.1 CCFG
      2. 8.2.2 CCFG Permissions/Restrictions that Affect Flash Programming
      3. 8.2.3 SACI Flash Programming Commands
      4. 8.2.4 Flash Programming Flows
        1. 8.2.4.1 Initial Programming of a New Device
        2. 8.2.4.2 Reprogramming of Previously Programmed Device
        3. 8.2.4.3 Add User Record on Already Programmed Device as Part of Commissioning Step
        4. 8.2.4.4 Incrementally Program Ancillary Data to MAIN Flash Sectors of a Previously Programmed Device
        5. 8.2.4.5 Debug Flow Charts
    3. 8.3 Device Management Command Interface
      1. 8.3.1 SACI Communication Protocol
        1. 8.3.1.1 Host Side Protocol
        2. 8.3.1.2 Command Format
        3. 8.3.1.3 Response Format
        4. 8.3.1.4 Response Result Field
        5. 8.3.1.5 Command Sequence Tag
        6. 8.3.1.6 Host Side Timeout
      2. 8.3.2 SACI Commands
        1. 8.3.2.1 Miscellaneous Commands
          1. 8.3.2.1.1 SACI_CMD_MISC_NO_OPERATION
          2. 8.3.2.1.2 SACI_CMD_MISC_GET_DIE_ID
          3. 8.3.2.1.3 SACI_CMD_MISC_GET_CCFG_USER_REC
        2. 8.3.2.2 Debug Commands
          1. 8.3.2.2.1 SACI_CMD_DEBUG_REQ_PWD_ID
          2. 8.3.2.2.2 SACI_CMD_DEBUG_SUBMIT_AUTH
          3. 8.3.2.2.3 SACI_CMD_DEBUG_EXIT_SACI_HALT
          4. 8.3.2.2.4 SACI_CMD_DEBUG_EXIT_SACI_SHUTDOWN
          5. 8.3.2.2.5 SACI_CMD_BLDR_APP_RESET_DEVICE
          6. 8.3.2.2.6 SACI_CMD_BLDR_APP_EXIT_SACI_RUN
        3. 8.3.2.3 Flash Programming Commands
          1. 8.3.2.3.1 SACI_CMD_FLASH_ERASE_CHIP
          2. 8.3.2.3.2 SACI_CMD_FLASH_PROG_CCFG_SECTOR
          3. 8.3.2.3.3 SACI_CMD_FLASH_PROG_CCFG_USER_REC
          4. 8.3.2.3.4 SACI_CMD_FLASH_PROG_MAIN_SECTOR
          5. 8.3.2.3.5 SACI_CMD_FLASH_PROG_MAIN_PIPELINED
          6. 8.3.2.3.6 SACI_CMD_FLASH_VERIFY_MAIN_SECTORS
          7. 8.3.2.3.7 SACI_CMD_FLASH_VERIFY_CCFG_SECTOR
    4. 8.4 Bootloader Support
      1. 8.4.1 Bootloader Parameters
      2. 8.4.2 Persistent State
      3. 8.4.3 User-Defined Bootloader Guidelines
    5. 8.5 ROM Serial Bootloader
      1. 8.5.1 ROM Serial Bootloader Interfaces
        1. 8.5.1.1 Packet Handling
          1. 8.5.1.1.1 Packet Acknowledge and Not-Acknowledge Bytes
        2. 8.5.1.2 Transport Layer
          1. 8.5.1.2.1 UART Transport
            1. 8.5.1.2.1.1 UART Baud Rate Automatic Detection
          2. 8.5.1.2.2 SPI Transport
      2. 8.5.2 ROM Serial Bootloader Parameters
      3. 8.5.3 ROM Serial Bootloader Commands
        1. 8.5.3.1 BLDR_CMD_PING
        2. 8.5.3.2 BLDR_CMD_GET_STATUS
        3. 8.5.3.3 BLDR_CMD_GET_PART_ID
        4. 8.5.3.4 BLDR_CMD_RESET
        5. 8.5.3.5 BLDR_CMD_CHIP_ERASE
        6. 8.5.3.6 BLDR_CMD_CRC32
        7. 8.5.3.7 BLDR_CMD_DOWNLOAD
        8. 8.5.3.8 BLDR_CMD_DOWNLOAD_CRC
        9. 8.5.3.9 BLDR_CMD_SEND_DATA
      4. 8.5.4 Bootloader Firmware Update Example
  11. 9 Device Configuration
    1. 9.1 Factory Configuration (FCFG)
    2. 9.2 Customer Configuration (CCFG)
  12. 10General Purpose Timers (LGPT)
    1. 10.1 Overview
    2. 10.2 Block Diagram
    3. 10.3 Functional Description
      1. 10.3.1  Prescaler
      2. 10.3.2  Counter
      3. 10.3.3  Target
      4. 10.3.4  Channel Input Logic
      5. 10.3.5  Channel Output Logic
      6. 10.3.6  Channel Actions
        1. 10.3.6.1 Period and Pulse Width Measurement
        2. 10.3.6.2 Clear on Zero, Toggle on Compare Repeatedly
        3. 10.3.6.3 Set on Zero, Toggle on Compare Repeatedly
      7. 10.3.7  Channel Capture Configuration
      8. 10.3.8  Channel Filters
        1. 10.3.8.1 Setting up the Channel Filters
      9. 10.3.9  Synchronize Multiple LGPT Timers
      10. 10.3.10 Interrupts, ADC Trigger, and DMA Request
    4. 10.4 Timer Modes
      1. 10.4.1 Quadrature Decoder
      2. 10.4.2 DMA
      3. 10.4.3 IR Generation
      4. 10.4.4 Fault and Park
      5. 10.4.5 Deadband
      6. 10.4.6 Deadband, Fault, and Park
      7. 10.4.7 Example Application: Brushless DC (BLDC) Motor
    5. 10.5 LGPT0 Registers
    6. 10.6 LGPT1 Registers
    7. 10.7 LGPT2 Registers
    8. 10.8 LGPT3 Registers
  13. 11System Timer (SYSTIM)
    1. 11.1 Overview
    2. 11.2 Block Diagram
    3. 11.3 Functional Description
      1. 11.3.1 Common Channel Features
        1. 11.3.1.1 Compare Mode
        2. 11.3.1.2 Capture Mode
        3. 11.3.1.3 Additional Channel Arming Methods
      2. 11.3.2 Interrupts and Events
    4. 11.4 SYSTIM Registers
  14. 12Real Time Clock (RTC)
    1. 12.1 Introduction
    2. 12.2 Block Diagram
    3. 12.3 Interrupts and Events
      1. 12.3.1 Input Event
      2. 12.3.2 Output Event
      3. 12.3.3 Arming and Disarming Channels
    4. 12.4 Capture and Compare Configuration
      1. 12.4.1 Capture
      2. 12.4.2 Compare
    5. 12.5 RTC Registers
  15. 13Low Power Comparator and SYS0
    1. 13.1 Introduction
    2. 13.2 Block Diagram
    3. 13.3 Functional Description
      1. 13.3.1 Input Selection
      2. 13.3.2 Voltage Divider
      3. 13.3.3 Hysteresis
      4. 13.3.4 Wake-Up
    4. 13.4 SYS0 Registers
  16. 14Battery Monitor, Temperature Sensor, and DCDC Controller (PMUD)
    1. 14.1 Introduction
    2. 14.2 Functional Description
      1. 14.2.1 BATMON
      2. 14.2.2 DCDC
    3. 14.3 PMUD Registers
  17. 15Micro Direct Memory Access (µDMA)
    1. 15.1 Introduction
    2. 15.2 Block Diagram
    3. 15.3 Functional Description
      1. 15.3.1  Channel Assignments
      2. 15.3.2  Priority
      3. 15.3.3  Arbitration Size
      4. 15.3.4  Request Types
        1. 15.3.4.1 Single Request
        2. 15.3.4.2 Burst Request
      5. 15.3.5  Channel Configuration
      6. 15.3.6  Transfer Modes
        1. 15.3.6.1 Stop Mode
        2. 15.3.6.2 Basic Mode
        3. 15.3.6.3 Auto Mode
        4. 15.3.6.4 Ping-Pong Mode
        5. 15.3.6.5 Memory Scatter-Gather Mode
        6. 15.3.6.6 Peripheral Scatter-Gather Mode
      7. 15.3.7  Transfer Size and Increments
      8. 15.3.8  Peripheral Interface
      9. 15.3.9  Software Request
      10. 15.3.10 Interrupts and Errors
      11. 15.3.11 Initialization and Configuration
        1. 15.3.11.1 Module Initialization
        2. 15.3.11.2 Configuring a Memory-to-Memory Transfer
        3. 15.3.11.3 Configure the Channel Attributes
        4. 15.3.11.4 Configure the Channel Control Structure
        5. 15.3.11.5 Start the Transfer
        6. 15.3.11.6 Software Considerations
    4. 15.4 DMA Registers
  18. 16Advanced Encryption Standard (AES)
    1. 16.1 Introduction
      1. 16.1.1 AES Performance
    2. 16.2 Functional Description
      1. 16.2.1 Reset Considerations
      2. 16.2.2 Interrupt and Event Support
        1. 16.2.2.1 Interrupt Events and Requests
        2. 16.2.2.2 Connection to Event Fabric
      3. 16.2.3 µDMA
        1. 16.2.3.1 µDMA Example
    3. 16.3 Encryption and Decryption Configuration
      1. 16.3.1  CBC-MAC (Cipher Block Chaining-Message Authentication Code)
      2. 16.3.2  CBC (Cipher Block Chaining) Encryption
      3. 16.3.3  CBC Decryption
      4. 16.3.4  CTR (Counter) Encryption/Decryption
      5. 16.3.5  ECB (Electronic Code Book) Encryption
      6. 16.3.6  ECB Decryption
      7. 16.3.7  CFB (Cipher Feedback) Encryption
      8. 16.3.8  CFB Decryption
      9. 16.3.9  OFB (Open Feedback) Encryption
      10. 16.3.10 OFB Decryption
      11. 16.3.11 PCBC (Propagating Cipher Block Chaining) Encryption
      12. 16.3.12 PCBC Decryption
      13. 16.3.13 CTR-DRBG (Counter-Deterministic Random Bit Generator)
      14. 16.3.14 CCM
    4. 16.4 AES Registers
  19. 17Analog to Digital Converter (ADC)
    1. 17.1 Overview
    2. 17.2 Block Diagram
    3. 17.3 Functional Description
      1. 17.3.1  ADC Core
      2. 17.3.2  Voltage Reference Options
      3. 17.3.3  Resolution Modes
      4. 17.3.4  ADC Clocking
      5. 17.3.5  Power-Down Behavior
      6. 17.3.6  Sampling Trigger Sources and Sampling Modes
        1. 17.3.6.1 AUTO Sampling Mode
        2. 17.3.6.2 MANUAL Sampling Mode
      7. 17.3.7  Sampling Period
      8. 17.3.8  Conversion Modes
      9. 17.3.9  ADC Data Format
      10. 17.3.10 Status Register
      11. 17.3.11 ADC Events
        1. 17.3.11.1 CPU Interrupt Event Publisher (INT_EVENT0)
        2. 17.3.11.2 Generic Event Publisher (INT_EVENT1)
        3. 17.3.11.3 DMA Trigger Event Publisher (INT_EVENT2)
        4. 17.3.11.4 Generic Event Subscriber
    4. 17.4 Advanced Features
      1. 17.4.1 Window Comparator
      2. 17.4.2 DMA and FIFO Operation
        1. 17.4.2.1 DMA/CPU Operation in Non-FIFO Mode (FIFOEN=0)
        2. 17.4.2.2 DMA/CPU Operation in FIFO Mode (FIFOEN=1)
        3. 17.4.2.3 DMA/CPU Operation Summary Matrix
      3. 17.4.3 Ad-Hoc Single Conversion
    5. 17.5 ADC Registers
  20. 18I/O Controller (IOC)
    1. 18.1  Introduction
    2. 18.2  Block Diagram
    3. 18.3  I/O Mapping and Configuration
      1. 18.3.1 Basic I/O Mapping
      2. 18.3.2 Radio GPO
      3. 18.3.3 Pin Mapping
      4. 18.3.4 DTB Muxing
    4. 18.4  Edge Detection
    5. 18.5  GPIO
    6. 18.6  I/O Pins
    7. 18.7  Unused Pins
    8. 18.8  Debug Configuration
    9. 18.9  IOC Registers
    10. 18.10 GPIO Registers
  21. 19Universal Asynchronous Receiver/Transmitter (UART)
    1. 19.1 Introduction
    2. 19.2 Block Diagram
    3. 19.3 Functional Description
      1. 19.3.1 Transmit and Receive Logic
      2. 19.3.2 Baud Rate Generation
      3. 19.3.3 FIFO Operation
        1. 19.3.3.1 FIFO Remapping
      4. 19.3.4 Data Transmission
      5. 19.3.5 Flow Control
      6. 19.3.6 IrDA Encoding and Decoding
      7. 19.3.7 Interrupts
      8. 19.3.8 Loopback Operation
    4. 19.4 Interface to µDMA
    5. 19.5 Initialization and Configuration
    6. 19.6 UART Registers
  22. 20Serial Peripheral Interface (SPI)
    1. 20.1 Overview
      1. 20.1.1 Features
      2. 20.1.2 Block Diagram
    2. 20.2 Signal Description
    3. 20.3 Functional Description
      1. 20.3.1  Clock Control
      2. 20.3.2  FIFO Operation
        1. 20.3.2.1 Transmit FIFO
        2. 20.3.2.2 Repeated Transmit Operation
        3. 20.3.2.3 Receive FIFO
        4. 20.3.2.4 FIFO Flush
      3. 20.3.3  Interrupts
      4. 20.3.4  Data Format
      5. 20.3.5  Delayed Data Sampling
      6. 20.3.6  Chip Select Control
      7. 20.3.7  Command Data Control
      8. 20.3.8  Protocol Descriptions
        1. 20.3.8.1 Motorola SPI Frame Format
        2. 20.3.8.2 Texas Instruments Synchronous Serial Frame Format
        3. 20.3.8.3 MICROWIRE Frame Format
      9. 20.3.9  CRC Configuration
      10. 20.3.10 Auto CRC Functionality
      11. 20.3.11 Auto Header Functionality
      12. 20.3.12 SPI Status
      13. 20.3.13 Debug Halt
    4. 20.4 µDMA Operation
    5. 20.5 Initialization and Configuration
    6. 20.6 SPI Registers
  23. 21Inter-Integrated Circuit (I2C)
    1. 21.1 Introduction
    2. 21.2 Block Diagram
    3. 21.3 Functional Description
      1. 21.3.1 Functional Overview
        1. 21.3.1.1 Start and Stop Conditions
        2. 21.3.1.2 Data Format with 7-Bit Address
        3. 21.3.1.3 Data Validity
        4. 21.3.1.4 Acknowledge
        5. 21.3.1.5 Arbitration
      2. 21.3.2 Available Speed Modes
      3. 21.3.3 Interrupts
        1. 21.3.3.1 I2C Controller Interrupts
        2. 21.3.3.2 I2C Target Interrupts
      4. 21.3.4 Loopback Operation
      5. 21.3.5 Command Sequence Flow Charts
        1. 21.3.5.1 I2C Controller Command Sequences
        2. 21.3.5.2 I2C Target Command Sequences
    4. 21.4 Initialization and Configuration
    5. 21.5 I2C Registers
  24. 22Radio
    1. 22.1 Introduction
    2. 22.2 Block Diagram
    3. 22.3 Overview
      1. 22.3.1 Radio Sub-Domains
      2. 22.3.2 Radio RAMs
      3. 22.3.3 Doorbell (DBELL)
        1. 22.3.3.1 Interrupts
        2. 22.3.3.2 GPIO Control
        3. 22.3.3.3 SYSTIM Interface
    4. 22.4 Radio Usage Model
      1. 22.4.1 CRC and Whitening
    5. 22.5 LRFDDBELL Registers
    6. 22.6 LRFDRXF Registers
    7. 22.7 LRFDTXF Registers
  25. 23Revision History

14.2.2 DCDC

DCDC buck converter is a switch mode power supply that generates regulated output voltage from a higher unregulated supply. Compared to linear regulators, DCDC has a higher power efficiency which reduces total energy consumption of the SoC.

DCDC is connected in parallel with a linear regulator (GLDO), in the CC23xx implementation.

DCDC supports a maximum load current of around 45mA when configured to the maximum value. GLDO can support a peak load current of up to approximately 55mA. In applications where higher load current needs are to be met, GLDO is enabled automatically preventing VDDR output from going low. The best possible power efficiency is achieved across load variations with the parallel operation of DCDC and GLDO.

The input supply of DCDC can range from 2.2V to 3.8V. DCDC regulates the output to 1.5V. But for GLDO, the supply can range from 1.71V to 3.8V to generate a regulated output of 1.5V. DCDC hardware is designed so that when the supply voltage drops below 2.2V, DCDC automatically shuts off and only GLDO generates the regulated VDDR.

GLDO can operate independently, but DCDC needs GLDO to support driving a higher load above the DCDC limit.

DCDC hardware implements these features to provide smooth and parallel operation of DCDC and GLDO:

  • Load meter
  • GLDO enable toggle logic
  • Adaptive peak current control

Load meter:

The load meter is used to measure the load on DCDC output as a percentage of maximum load support by DCDC. Load meter can be enabled by PMUD.DCDCCFG.LM_EN and the output is available on the status register PMUD.DCDCSTAT.LOAD. After the load meter feature is enabled, it takes approximately 500µs to generate the first output, and for any subsequent load change, it can take approximately 250µs to update the register to the accurate load level.

GLDO enable toggle logic:

GLDO enable toggle logic is used for parallel operation of DCDC and GLDO. As the load increases on VDDR above DCDC load support, GLDO is enabled by the analog circuit almost instantly. This feature is used prevent undesirable and repeated enable and disable toggles of GLDO when the load on VDDR is close to maximum DCDC load support, which can result in a higher VDDR ripple.

This feature also enables the load meter. Once GLDO is enabled due to a higher VDDR load, load meter output is continuously compared with an internally programmed DCDC load threshold. Once the load on DCDC is less than the threshold, GLDO is safely disabled. The hardware also provides a minimum enable window for GLDO to reduce the ripples on VDDR.

Adaptive peak current control:

DCDC has a programmable peak current to vary the maximum load support. To support higher load, DCDC can be programmed to higher peak current setting, but then DCDC operates on a reduced power efficiency. With lower peak current DCDC works with higher efficiency but with lower maximum load support. So, for given load on VDDR, there is an optimum peak current setting for DCDC which provides the best power efficiency. Adaptive peak current control is an algorithm that updates peak current dynamically until the optimum value is reached.

For the operation of Adaptive peak current control, load meter output is continuously monitored against two programmable DCDC load thresholds (high threshold and low threshold). If the load on DCDC is more than the high threshold, the algorithm increments the peak current value programmed. If the load on DCDC drops below the low threshold, the programmed peak current value is decremented. For a given load on VDDR, after a few increments and decrements, the final peak current value reaches the optimum setting for the best power efficiency. Each increment or decrement operation can have a delay of up to 250µs, and to reach the optimum peak current setting, the adaptive peak current control algorithm can take up to 1ms.

Registers used for Adaptive peak current control:

  1. DCDCCFG.ADP_IPEAK_EN: Enables Adaptive peak current control hardware algorithm.
  2. DCDCCFG.LM_HIGHTH: DCDC load meter high threshold value. DCDC load meter output is in a percentage scale so the valid values are ‘d1 to ‘d100. Values from ‘d101 to ‘d127 are invalid and are not to be used. The recommended value is ‘d80.
  3. DCDCCFG.LM_LOWTH: DCDC load meter low threshold value. The recommended value is ‘d50.
  4. SYS0.TMUTE4.IPEAK: This field can be used to program the maximum current that has to be supported by DCDC from ‘d0 (approximately 14mA) to ‘d7 (approximately 45mA). When the adaptive algorithm is enabled, then this value acts as the limit up to which the algorithm can increment the DCDC peak current.
  5. DCDCSTAT.IPEAK: DCDC peak current value programmed within the SYS0.TMUTE4.IPEAK register when this algorithm is not enabled. When this is enabled, this register outputs the peak current value being driven by the algorithm.