The UCD9081 power-supply sequencer controls the enable sequence of up to eight independent voltage rails and provides four general-purpose digital outputs (GPO). The device operates from a 3.3-V supply, provides 3.2-mV resolution of voltage rails, and requires no external memory or clock. The UCD9081 monitors the voltage rails independently and has a high degree of rail sequence and alarm response options. The sequencing of rails can be based on timed events or on timed events in conjunction with other rails achieving regulation or a voltage threshold. In addition, each rail is monitored for undervoltage and overvoltage glitches and thresholds. Each rail the UCD9081 monitors can be configured to shut down a user-defined set of other rails and GPOs, and alarm conditions are monitored on a per-rail basis.
Figure 20 shows the UCD9081 power-supply sequencer in a typical application.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
UCD9081 | VQFN (32) | 5.00 mm × 5.00 mm |
Changes from B Revision (December 2010) to C Revision
Changes from A Revision (September 2008) to B Revision
Changes from * Revision (June 2008) to A Revision
PIN(1) | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
ADDR2/GPO2 | 26 | I/O | I2C address select 2, general-purpose digital output 2 |
ADDR3/GPO3 | 27 | I/O | I2C address select 3, general-purpose digital output 3 |
ADDR4/GPO4 | 28 | I/O | I2C address select 4, general-purpose digital output 4 |
EN1 | 23 | I/O | Voltage rail 1 enable (digital output) |
EN2 | 24 | I/O | Voltage rail 2 enable (digital output) |
EN3 | 11 | I/O | Voltage rail 3 enable (digital output) |
EN4 | 10 | I/O | Voltage rail 4 enable (digital output) |
EN5 | 12 | I/O | Voltage rail 5 enable (digital output) |
EN6 | 13 | I/O | Voltage rail 6 enable (digital output) |
EN7 | 14 | I/O | Voltage rail 7 enable (digital output) |
EN8/ADDR1/ GPO1 |
25 | I/O | Voltage rail 8 enable (digital output), I2C address select 1, general-purpose digital output 1 |
MON1 | 6 | I | Analog input for voltage rail 1 |
MON2 | 7 | I | Analog input for voltage rail 2 |
MON3 | 8 | I | Analog input for voltage rail 3 |
MON4 | 18 | I | Analog input for voltage rail 4 |
MON5 | 19 | I | Analog input for voltage rail 5 |
MON6 | 9 | I | Analog input for voltage rail 6 |
MON7 | 15 | I | Analog input for voltage rail 7 |
MON8 | 16 | I | Analog input for voltage rail 8 |
NC | 2 | — | Do not connect |
NC | 4, 17, 20, 31 |
— | Recommended to connect to VSS, pin is not connected internally |
ROSC | 32 | — | Internal oscillator frequency adjust. Must use 100-kΩ pullup to VCC for minimum drift and maximum frequency when sampling voltage rails. |
RST | 5 | I | Reset input |
SCL | 22 | I/O | I2C clock. Must pull up to 3.3 V. |
SDA | 21 | I/O | I2C data. Must pull up to 3.3 V. |
TEST | 29 | I | Connect to VSS |
VCC | 30 | — | Supply voltage |
VSS | 1 | — | Ground reference |
XIN | 3 | — | Connect to VCC |
PowerPAD™ | — | — | Package pad. Recommended to connect to VSS. |
MIN | MAX | UNIT | |
---|---|---|---|
Voltage applied from VCC to VSS | –0.3 | 4.1 | V |
Voltage applied to any pin(2) | –0.3 | VCC + 0.3 | V |
ESD diode current at any device terminal | ±2 | mA | |
Storage temperature, Tstg | –40 | 85 | °C |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VCC | Supply voltage during operation and configuration changes | 3 | 3.3 | 3.6 | V |
TA | Operating free-air temperature | –40 | 85 | °C |
THERMAL METRIC(1) | UCD9081 | UNIT | |
---|---|---|---|
RHB (VQFN) | |||
32 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 5.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.2 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
SUPPLY CURRENT | |||||||
IS | Supply current into VCC | TA = 25°C, excluding external current | 3 | 4 | mA | ||
IC | Supply current during configuration | VCC = 3.6 V | 3 | 7 | mA | ||
STANDARD INPUTS (RST, TEST) | |||||||
VIL | Low-level input voltage | VCC = 3 V | VSS | VSS + 0.6 | V | ||
VIH | High-level input voltage | VCC = 3 V | 0.8 × VCC | VCC | V | ||
SCHMITT TRIGGER INPUTS (SDA, SCL, EN[1...7], EN8/ADDR1, ADDR[2...4]) | |||||||
VIT+ | Positive-going input threshold voltage | VCC = 3 V | 1.5 | 1.9 | V | ||
VIT– | Negative-going input threshold voltage | VCC = 3 V | 0.9 | 1.3 | V | ||
Vhys | Input voltage hysteresis | VCC = 3 V, VIT+ – VIT– | 0.5 | 1 | V | ||
Ilkg | High-impedance leakage current | ±50 | nA | ||||
ANALOG INPUTS (MONx, ROSC) | |||||||
VCC | Analog supply voltage | VSS = 0 V | 3 | 3.6 | V | ||
VMON<1..8> | Analog input voltage | Internal voltage reference selected | 0 | 2.5 | V | ||
External voltage reference selected (VCC used as reference) |
0 | VCC | |||||
CI(1) | Input capacitance | Only one terminal can be selected at a time (MON1 to MON8) | 27 | pF | |||
RI(1) | Input MUX ON resistance | 0 V ≤ VMONx ≤ VCC, VCC = 3 V | 2000 | Ω | |||
Ilkg | High-impedance leakage current | MON1 to MON8 | ±50 | nA | |||
VREF+ | Positive internal reference voltage | Internal voltage reference selected, VCC = 3 V |
2.35 | 2.5 | 2.65 | V | |
VTUE | ADC total unadjusted error | VCC = 3 V | VR+ = 2.5 V (internal reference) |
±12.2 | mV | ||
VR+ = VCC
(external reference) |
±14.7 | ||||||
TREF+(1) | Temperature coefficient of internal voltage reference | I(VREF+) is a constant in the range of 0 mA ≤ I(VREF+) ≤ 1 mA, VCC = 3 V |
±100 | ppm/°C | |||
MISCELLANEOUS | |||||||
Tretention | Retention of configuration parameters | TJ = 25°C | 100 | Years | |||
POR, BROWNOUT, RESET(4)(5) | |||||||
td(BOR) | Brownout | 2000 | µs | ||||
VCC(start) | Brownout | dVCC/dt ≤ 3 V/s | 0.7 × V(B_IT–) | V | |||
V(B_IT–) | Brownout | dVCC/dt ≤ 3 V/s | 1.71 | V | |||
Vhys(B_IT–) | Brownout | dVCC/dt ≤ 3 V/s | 70 | 130 | 180 | mV | |
t(reset) | Brownout | Pulse length required at RST pin to accept reset internally, VCC = 3 V | 2 | µs | |||
DIGITAL OUTPUTS (EN8/GPO1, GPO[2...4], EN[1...7], SDA, SCL) | |||||||
VOH | High-level output voltage | IOHmax = –1.5 mA(2), VCC = 3 V | VCC – 0.25 | VCC | V | ||
IOHmax = –6 mA(3), VCC = 3 V | VCC – 0.6 | VCC | |||||
VOL | Low-level output voltage | IOLmax = 1.5 mA(2), VCC = 3 V | VSS | VSS + 0.25 | V | ||
IOLmax = 6 mA(3), VCC = 3 V | VSS | VSS + 0.6 | |||||
Ilkg | High-impedance leakage current | VCC = 3 V | ±50 | nA |
MIN | MAX | UNIT | ||
---|---|---|---|---|
tofof | Output fall time from VOH to VOL(1) with a bus capacitance from 10 pF to 400 pF | 250(2) | ns | |
CI | Capacitance for each pin | 10 | pF | |
fSCL | SCL clock frequency | 10 | 100 | kHz |
tHD;STA | Repeated hold time START condition (after this period, the first clock pulse is generated) | 4 | µs | |
tHD;DAT | Data hold time | 0(3) | 3.45(4) | µs |
tLOW | LOW period of the SCL clock | 4.7 | µs | |
tHIGH | HIGH period of the SCL clock | 4 | µs | |
tSU;STA | Setup time for repeated start condition | 4.7 | µs | |
tSU;DAT | Data setup time | 250 | ns | |
tr | Rise time of both SDA and SCL signals | 1000 | ns | |
tf | Fall time of both SDA and SCL signals | 300 | ns | |
tSU;STO | Setup time for STOP condition | 4 | µs | |
tBUF | Bus free time between a STOP and START condition | 4.7 | µs | |
C(b) | Capacitive load for each bus line | 400 | pF | |
VnL | Noise margin at the LOW level for each connected device (including hysteresis) | 0.1 × VDD | V | |
VnH | Noise margin at the HIGH level for each connected device (including hysteresis) | 0.2 × VDD | V |