SBAS941A May   2019  – November 2019 AMC1035-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Example
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings Automotive
    3. Table 1. Recommended Operating Conditions
    4. 6.3      Thermal Information
    5. 6.4      Electrical Characteristics
    6. 6.5      Switching Characteristics
    7. 6.6      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Reference Output
      4. 7.3.4 Clock Input
      5. 7.3.5 Digital Output
      6. 7.3.6 Manchester Coding Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Behavior in Case of a Full-Scale Input
      2. 7.4.2 Fail-Safe Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Digital Filter Usage
    2. 8.2 Typical Applications
      1. 8.2.1 Voltage Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IGBT Temperature Sensing
      3. 8.2.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) AMC1035-Q1 UNIT
D (SOIC)
8 PINS
RΘJA Junction-to-ambient thermal resistance 120 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 52 °C/W
RΘJB Junction-to-board thermal resistance 61 °C/W
YJT Junction-to-top characterization parameter 10 °C/W
YJB Junction-to-board characterization parameter 60 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.