SBASAB0 December   2021 AMC1350-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 What To Do and What Not To Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

6.6 Insulation Specifications

over operating ambient temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VALUE UNIT
GENERAL
CLR External clearance(1) Shortest pin-to-pin distance through air ≥ 8.5 mm
CPG External creepage(1) Shortest pin-to-pin distance across the package surface ≥ 8.5 mm
DTI Distance through insulation Minimum internal gap (internal clearance) of the double insulation ≥ 0.021 mm
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 ≥ 600 V
Material group According to IEC 60664-1 I
Overvoltage category
per IEC 60664-1		 Rated mains voltage ≤ 600 VRMS I-IV
Rated mains voltage ≤ 1000 VRMS I-III
DIN VDE V 0884-11 (VDE V 0884-11): 2017-01
VIORM Maximum repetitive peak isolation voltage At AC voltage 2120 VPK
VIOWM Maximum-rated isolation
working voltage		 At AC voltage (sine wave) 1500 VRMS
At DC voltage 2120 VDC
VIOTM Maximum transient
isolation voltage		 VTEST = VIOTM, t = 60 s (qualification test) 7070 VPK
VTEST = 1.2 × VIOTM, t = 1 s (100% production test) 8480
VIOSM Maximum surge
isolation voltage(2)		 Test method per IEC 60065, 1.2/50-µs waveform,
VTEST = 1.6 × VIOSM = 12800 VPK (qualification)		 8000 VPK
qpd Apparent charge(3) Method a, after input/output safety test subgroups 2 and 3,
Vini = VIOTM, tini = 60 s, Vpd(m) = 1.2 × VIORM, tm = 10 s		 ≤ 5 pC
Method a, after environmental tests subgroup 1,
Vini = VIOTM, tini = 60 s, Vpd(m) = 1.6 × VIORM, tm = 10 s		 ≤ 5
Method b1, at routine test (100% production) and preconditioning (type test), Vini = VIOTM, tini = 1 s, Vpd(m) = 1.875 × VIORM, tm = 1 s ≤ 5
CIO Barrier capacitance,
input to output(4)		 VIO = 0.5 VPP at 1 MHz ~1.5 pF
RIO Insulation resistance,
input to output(4)		 VIO = 500 V at TA = 25°C > 1012 Ω
VIO = 500 V at 100°C ≤ TA ≤ 125°C > 1011
VIO = 500 V at TS = 150°C > 109
Pollution degree 2
Climatic category 55/125/21
UL1577
VISO Withstand isolation voltage VTEST = VISO = 5000 VRMS or 7071 VDC, t = 60 s (qualification),
VTEST = 1.2 × VISO = 6000 VRMS, t = 1 s (100% production test)		 5000 VRMS
(1) Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal in certain cases. Techniques such as inserting grooves, ribs, or both on a PCB are used to help increase these specifications.
(2) Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
(3) Apparent charge is electrical discharge caused by a partial discharge (pd).
(4) All pins on each side of the barrier are tied together, creating a two-pin device.