SBAU425 July   2024 TMCS1127

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  6. 2Hardware
    1. 2.1 Circuitry
      1. 2.1.1 Bypass Capacitors
      2. 2.1.2 Output Filter
      3. 2.1.3 Load Connectors
      4. 2.1.4 TMCS1127 Isolated Current-Sense Amplifier
    2. 2.2 Measurements
      1. 2.2.1 Advanced Measurement Tips
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation From Texas Instruments

2.2 Measurements

The following procedures are used to configure a measurement evaluation with an electronic load.

  1. As illustrated in Figure 2-1, for a low-side measurement, connect the electronic load positive input terminal to the positive terminal of a supply capable of sourcing the desired amount of maximum load current. For a high-side measurement, connect the electronic load positive input terminal to the load sourcing terminal (IN+ or IN–) of the EVM. For high-side measurement of forward current, IN– sources to the electronic load; for reverse current, IN+ sources to the load.
  2. Connect the electronic load negative output terminal to the external supply GND terminal for high-side measurements, or to the load sinking terminal of the EVM for low-side measurements.
  3. For high-side measurements, connect the external supply to the load sinking terminal of the EVM. Otherwise, for low-side measurements, connect the load sourcing terminal of the EVM (IN+ or IN–) to the external supply GND.
  4. Turn on all the connected supplies.
  5. Apply load with electronic load or actual system load.
  6. Measure the output voltage at the VOUT test point.
Note:

The output voltage is equal to the sensitivity of the device multiplied by the load current passing through the leadframe of the DUT.