1 Thermal Handling

System attributes such as copper weight, copper input plane size, an added heat sink, nearby heat sources, and fans all can significantly impact thermal performance. Despite the uniqueness of any given thermal environment, by using the steps listed in this application report, one can verify how a device like the TMCS1100 thermally performs in a system. The basic steps for analysis are as follows:

1. Probes and Measurement Setup
2. ESD Body Diode Characterization
3. Measuring Junction Temperature
4. Measuring Case Temperature
5. Case to Junction Temperature Correlation

With the steps outlined, multiple layouts were measured and compared. The results of this process are given in the Measurement Results section.