SBOA564A December 2022 – August 2024 TRF0206-SP
The primary concern for the TRF0206-SP are its resilience against the destructive single-event effects (DSEE), such as single-event latch-up (SEL) and single-event-burnout (SEB). Since the operating voltage of TRF0206-SP is low, SEB is not a concern.
The TRF0206-SP was characterized for SEL events. In mixed technologies, such as the SiGe-BiCMOS process used for the TRF0206-SP, the presence of the CMOS circuitry introduces a potential SEL susceptibility. SEL can occur if excess current injection caused by the passage of an energetic ion is high enough to trigger the formation of a parasitic cross-coupled PNP and NPN bipolar structure (formed between the p-substrate and n-well and n+ and p+ contacts) [1][2]. If formed, the parasitic bipolar structure creates a high-conductance path (creating a steady-state current that is orders-of-magnitude higher than the normal operating current) between power and ground that persists (is latched) until power is removed or until the device is destroyed by the high-current state. The TRF0206-SP exhibited no SEL with heavy-ions of up to LETEFF = 82.1 MeV-cm2/mg at fluences in excess of 107 ions/cm2 and a die temperature of 125°C.
Another concern on high reliability and performance applications is the single-events-transient (SET) characteristic of the device. The TRF0206-SP SET performance was characterized up to LETEFF = 74.92 MeV-cm2/mg. The device was characterized for SET at supply voltage of 3.3 V under DC input conditions. Test conditions and results are discussed in Section 8.