SBOS854F March   2018  – June 2024 TMP1075

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics:TMP1075
    6. 6.6  Electrical Characteristics: TMP1075N
    7. 6.7  Timing Requirements:TMP1075
    8. 6.8  Timing Requirements: TMP1075N
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 I2C and SMBus Serial Interface
        1. 7.3.2.1  Bus Overview
        2. 7.3.2.2  Serial Bus Address
        3. 7.3.2.3  Pointer Register
          1. 7.3.2.3.1 Pointer Register Byte [reset = 00h]
        4. 7.3.2.4  Writing and Reading to the TMP1075
        5. 7.3.2.5  Operation Mode
          1. 7.3.2.5.1 Receiver Mode
          2. 7.3.2.5.2 Transmitter Mode
        6. 7.3.2.6  SMBus Alert Function
        7. 7.3.2.7  General Call- Reset Function
        8. 7.3.2.8  High-Speed Mode (HS)
        9. 7.3.2.9  Coexists in I3C Mixed Fast Mode
        10. 7.3.2.10 Time-Out Function
      3. 7.3.3 Timing Diagrams
      4. 7.3.4 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-Shot Mode (OS)
      3. 7.4.3 Continuous Conversion Mode (CC)
      4. 7.4.4 Thermostat Mode (TM)
        1. 7.4.4.1 Comparator Mode (TM = 0)
        2. 7.4.4.2 Interrupt Mode (TM = 1)
        3. 7.4.4.3 Polarity Mode (POL)
    5. 7.5 Register Map
      1. 7.5.1 Register Descriptions
        1. 7.5.1.1 Temperature Register (address = 00h) [default reset = 0000h]
        2. 7.5.1.2 Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
        3. 7.5.1.3 Low Limit Register (address = 02h) [default reset = 4B00h]
        4. 7.5.1.4 High Limit Register (address = 03h) [default reset = 5000h]
        5. 7.5.1.5 Device ID Register (address = 0Fh) [default reset = 7500]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Migrating From the xx75 Device Family
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

3 Description

The TMP1075 is the most accurate and lowest power replacement to the industry standard LM75 and TMP75 digital temperature sensors. Available in SOIC-8, VSSOP-8, WSON-8, and SOT563-6 packages, the TMP1075 offers pin-to-pin and software compatibility to quickly upgrade any existing xx75 design. The TMP1075 additional new packages are a 2.0mm × 2.0mm DFN and a 1.6mm × 1.6mm SOT563-6 reducing the printed circuit board (PCB) footprint by 82% and 89% compared to the SOIC package, respectively.

The TMP1075 has a ±1°C accuracy over a wide temperature range and offers an on-chip 12-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.0625°C.

Compatible with two-wire SMBus and I2C interfaces, the TMP1075 support up to 32 device addresses and provides SMBus Reset and Alert function.

The TMP1075 D, DGK, and DSG packages are specified for operation over a temperature range of −55°C to 125°C and the TMP1075N DRL package is specified over the −40°C to 125°C temperature range.

The TMP1075 units are 100% tested on a production setup that is NIST traceable and verified with equipment that is calibrated to ISO/IEC 17025 accredited standards.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TMP1075 VSSOP (DGK, 8) 3.00mm × 4.90mm
SOIC (D, 8) 4.90mm × 6.00mm
WSON (DSG, 8) 2.00mm × 2.00mm
SOT563 (DRL, 6)(3) 1.60mm × 1.60mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) Available as the TMP1075N orderable.
TMP1075 Simplified Schematic Simplified Schematic
TMP1075 Temperature Accuracy
DGK and D packages
Temperature Accuracy