SBOSAA3A July 2024 – November 2024 TRF1108
PRODUCTION DATA
The TRF1108 is packaged in a 2mm × 2mm WQFN-FCRLF package that has excellent thermal properties. Connect the thermal pad under the chip to a wide VSS plane. Short the VSS plane to the other VSS pins of the chip at four corners, if possible, to allow heat propagation to the top layer of PCB. Use a thermal via to connect the thermal pad plane on the top layer of PCB to inner layer VSS planes to allow heat dissipation to the inner layers. See also Section 7.4.