SBOU250 November   2020 THS4567

PRODUCTION DATA  

  1. 1Trademarks
  2. 2Features
  3. 3EVM Specifications
  4. 4Power Connections
    1. 4.1 Split-Supply Operation
    2. 4.2 Single-Supply Operation
  5. 5Input and Output Connections
    1. 5.1 VOCM and VICM Input Connections
    2. 5.2 Enable Input Connections
    3. 5.3 Example EVM Configuration Using the THS4567
  6. 6 RUN-FDA-4567-EVM Schematic, Layout, and Bill of Materials
    1. 6.1 RUN-FDA-4567-EVM Layers
    2. 6.2 Bill of Materials
  7. 7References

RUN-FDA-4567-EVM Layers

Figure 6-2 through Figure 6-9 shows the RUN-FDA-4567-EVMPCB layers.

GUID-20201119-CA0I-HBGV-8QPR-FD4CCNDF9ZGP-low.png Figure 6-2 Top Layer Overlay
GUID-20201119-CA0I-PW9Z-89CK-X316CRCKSXBR-low.png Figure 6-3 Top Layer Solder Mask
GUID-20201119-CA0I-DLM3-ZQTN-MTP2HMFQDGRC-low.png Figure 6-4 Top Layer
GUID-20201119-CA0I-GSBM-9BQZ-ZWSQ1C8CT2FF-low.png Figure 6-5 Layer 2, Ground
GUID-20201119-CA0I-4G6M-SDG7-JVTHN8P09P2D-low.png Figure 6-6 Layer 3, Power
GUID-20201119-CA0I-NMMJ-SCB5-PFLXH7KF0PXK-low.png Figure 6-7 Bottom Layer
GUID-20201119-CA0I-6Q1G-RW3H-X1HQQ0SZ53CC-low.png Figure 6-8 Bottom Layer Solder Mask
GUID-20201119-CA0I-RDB9-WQ39-RKB12NXK88DZ-low.png Figure 6-9 Bottom Layer Overlay