SBOU297A April   2024  – July 2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 How to Setup
    3. 2.3 Assembly Instructions
    4. 2.4 Power Requirements
    5. 2.5 Setup
    6. 2.6 Header Information
    7. 2.7 Interfaces
    8. 2.8 Best Practices
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

2.8 Best Practices

For best user-experience, the following are recommended:

  1. Implement Section 2.3.
  2. If not already populated, solder on bypass capacitors on daughter card and the main board.
  3. Reference stability resources for robust op amp designs.
  4. Only utilize the ground surface mount test points as a ground reference. Avoid connecting GND and GND_p2p to the metal alignment poles. The alignment metal poles are mechanically but not electrically connected and can introduce a ground shift potential.