SBOU314 June   2024 TRF1305B2

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 EVM Bill of Material
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation

PCB Layout

Figure 4-2 through Figure 4-5 illustrate the PCB layers for this EVM.

TRF1305A2-D2D-EVM, TRF1305B2-D2D-EVM, TRF1305C2-D2D-EVM Top
                        LayerFigure 3-2 Top Layer
TRF1305A2-D2D-EVM, TRF1305B2-D2D-EVM, TRF1305C2-D2D-EVM Layer
                        3Figure 3-4 Layer 3
TRF1305A2-D2D-EVM, TRF1305B2-D2D-EVM, TRF1305C2-D2D-EVM Layer
                        2Figure 3-3 Layer 2
TRF1305A2-D2D-EVM, TRF1305B2-D2D-EVM, TRF1305C2-D2D-EVM Bottom LayerFigure 3-5 Bottom Layer