SBOU314
June 2024
TRF1305B2
1
Description
Features
4
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
General Usage Information
3
Hardware Design Files
3.1
Schematic
3.2
PCB Layout
3.2.1
Stack-Up and Material
3.3
EVM Bill of Material
4
Additional Information
4.1
Trademarks
5
Related Documentation
3.2
PCB Layout
Figure 4-2
through
Figure 4-5
illustrate the PCB layers for this EVM.
Figure 3-2
Top Layer
Figure 3-4
Layer 3
Figure 3-3
Layer 2
Figure 3-5
Bottom Layer