SBOU318 July   2024 TRF1108

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Implementation Results
    1. 3.1 Test Setup Diagrams
      1. 3.1.1 S-Parameter Test Setup
      2. 3.1.2 Noise Figure Test Setup
      3. 3.1.3 Two-Tone OIP3 Test Setup
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
      1. 4.2.1 Stack-Up and Material
    3. 4.3 TRF1108 EVM Bill of Material
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Related Documentation

4.2.1 Stack-Up and Material

The TRF1108 EVM is a 67-mil, 4-layer board whose material type is Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom 3 layers are ground layers.

TRF1108EVM TRF1108 EVM Stack-Up (Units in Mils) Figure 4-6 TRF1108 EVM Stack-Up (Units in Mils)