SCDA023B April   2020  – January 2022 TMUX1308-Q1 , TMUX1309-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP, SOT-23-THIN, and WQFN Packages
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX1308-Q1 TSSOP and SOT-23-THIN Package
    2. 4.2 TMUX1308-Q1 WQFN Package
    3. 4.3 TMUX1309-Q1 TSSOP and SOT-23-THIN Package
    4. 4.4 TMUX1309-Q1 WQFN Package
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TMUX1308-Q1 and TMUX1309-Q1 (TSSOP, SOT-23-THIN, and WQFN packages). The failure modes covered in this document include the following typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-4 also indicate how these pin conditions can affect the device per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance