SCDA023B April 2020 – January 2022 TMUX1308-Q1 , TMUX1309-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TMUX1308-Q1 and TMUX1309-Q1 (TSSOP, SOT-23-THIN, and WQFN packages). The failure modes covered in this document include the following typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-4 also indicate how these pin conditions can affect the device per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |