SCDA023B April   2020  – January 2022 TMUX1308-Q1 , TMUX1309-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP, SOT-23-THIN, and WQFN Packages
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX1308-Q1 TSSOP and SOT-23-THIN Package
    2. 4.2 TMUX1308-Q1 WQFN Package
    3. 4.3 TMUX1309-Q1 TSSOP and SOT-23-THIN Package
    4. 4.4 TMUX1309-Q1 WQFN Package
  6. 5Revision History

1 Overview

This document contains information for TMUX1308-Q1 and TMUX1309-Q1 (TSSOP, SOT-23-THIN, and WQFN packages) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-D40FD8A1-FB12-49B2-9EEA-27940A182562-low.gifFigure 1-1 Functional Block Diagram

TMUX1308-Q1 and TMUX1309-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.