SCDS434B October   2021  – March 2023 TMUX8211 , TMUX8212 , TMUX8213

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings: TMUX821x Devices
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: TMUX821x Devices
    4. 7.4  Source of Drain Continuous Current
    5. 7.5  Source of Drain Pulse Current
    6. 7.6  Thermal Information
    7. 7.7  Electrical Characteristics (Global): TMUX821x Devices
    8. 7.8  Electrical Characteristics (±15-V Dual Supply)
    9. 7.9  Electrical Characteristics (±36-V Dual Supply)
    10. 7.10 Electrical Characteristics (±50-V Dual Supply)
    11. 7.11 Electrical Characteristics (72-V Single Supply)
    12. 7.12 Electrical Characteristics (100-V Single Supply)
    13. 7.13 Switching Characteristics: TMUX821x Devices
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 On-Resistance
    2. 8.2 Off-Leakage Current
    3. 8.3 On-Leakage Current
    4. 8.4 Device Turn-On and Turn-Off Time
    5. 8.5 Charge Injection
    6. 8.6 Off Isolation
    7. 8.7 Crosstalk
    8. 8.8 Bandwidth
    9. 8.9 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Flat On-Resistance
      3. 9.3.3 Protection Features
        1. 9.3.3.1 Fail-Safe Logic
        2. 9.3.3.2 ESD Protection
        3. 9.3.3.3 Latch-Up Immunity
      4. 9.3.4 1.8 V Logic Compatible Inputs
      5. 9.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.13 Switching Characteristics: TMUX821x Devices

over operating free-air temperature range (unless otherwise noted) 
typical at VDD = +36 V, VSS = –36 V, GND = 0 V and TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tON (EN) Turn-on time from enable VS = 10 V
RL = 10 kΩ, CL = 15 pF		 25°C 4 µs
–40°C to +85°C 10
–40°C to +125°C 12
tOFF (EN) Turn-off time from enable VS = 10 V
RL = 10 kΩ, CL = 15 pF		 25°C 100 ns
–40°C to +85°C 600
–40°C to +125°C 700
tON (VDD) Device turn on time
(VDD to output)		 VDD ramp rate = 1 V/µs,
VS = 10 V
RL = 10 kΩ, CL = 15pF		 25°C 60 µs
tPD Propagation delay RL = 50 Ω , CL = 5 pF 25°C 190 ps
QINJ Charge injection VS = (VDD + VSS) / 2, CL = 1 nF 25°C –1.3 nC
OISO Off isolation RL = 50 Ω , CL = 5 pF
VS = (VDD + VSS) / 2, f = 100 kHz		 25°C –110 dB
XTALK Inter-channel crosstalk RL = 50 Ω , CL = 5 pF
VS = (VDD + VSS) / 2, f = 100 kHz		 25°C –110 dB
BW –3 dB bandwidth RL = 50 Ω , CL = 5 pF
VS = (VDD + VSS) / 2		 25°C 420 MHz
IL Insertion loss RL = 50 Ω , CL = 5 pF
VS = (VDD + VSS) / 2, f = 1 MHz		 25°C –0.4 dB
THD+N Total harmonic distortion + Noise Dual supply voltage
VPP = 5 V, VBIAS = (VDD + VSS) / 2
RL  =  1 kΩ , CL = 5 pF,
f = 20 Hz to 20 kHz		 25°C 0.0008 %
CS(OFF) Source off capacitance VS = (VDD + VSS) / 2 V, f = 1 MHz 25°C 12 pF
CD(OFF) Drain off capacitance VS = (VDD + VSS) / 2 V, f = 1 MHz 25°C 12 pF
CS(ON), CD(ON) On capacitance VS = (VDD + VSS) / 2 V, f = 1 MHz 25°C 14 pF