SCES964 June   2024 TXS0104V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information (PW, RGY, BQA, RUT, D)
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.8 ± 0.15V
    7. 5.7  Switching Characteristics, VCCA = 2.5 ± 0.2V
    8. 5.8  Switching Characteristics, VCCA = 3.3 ± 0.3V
    9. 5.9  Switching Characteristics: Tsk, TMAX
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup and Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information (PW, RGY, BQA, RUT, D)

THERMAL METRIC(1) TXS0104V UNIT
PW (TSSOP)  RGY (VQFN) BQA (WQFN) RUT (UQFN) D (SOIC)
14 PINS 14 PINS 14 PINS 12 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 115.2 52.9 73.5 150.4 93.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.2 54.3 76.9 68.6 53.8 °C/W
RθJB Junction-to-board thermal resistance 70.9 28.4 43.0 76.3 52.0 °C/W
YJT Junction-to-top characterization parameter 3.4 2.7 4.7 2.4 13.4 °C/W
YJB Junction-to-board characterization parameter 70.2 28.3 42.9 76.2 51.6 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A 12.0 19.6 N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.