SCPS272C October   2019  – January 2021 TCA9511A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hot bus insertion
      2. 8.3.2 Pre-charge voltage
      3. 8.3.3 Rise time accelerators
      4. 8.3.4 Bus ready output indicator
      5. 8.3.5 Powered-off high impedance for I2C and I/O pins
      6. 8.3.6 Supports clock stretching and arbitration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-up and precharge
      2. 8.4.2 Bus idle
      3. 8.4.3 Bus active
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Series connections
        2. 9.2.1.2 Multiple connections to a common node
        3. 9.2.1.3 Propagation delays
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application on a Backplane
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Best Practices
    2. 10.2 Power-on Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

6.5 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted). Typical specifications are at TA = 25 °C, VCC = 3.3 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
ICC Supply current VCC = 5.5V
SDAIN, SCLIN = 0V
SDAOUT, SCLOUT = 10k RPU 		2.5 4.5 mA
ISD Supply current in shutdown mode through the VCC pin(1) EN = 0 V
SDAIN, SCLIN, SDAOUT, SCLOUT = 0V or VCC
READY pin = Hi-Z
EN pulled low after bus connection event (disable precharge)		 5 30 µA
UVLO Under voltage lockout (rising) EN = VCC
READY = 10 kΩ to VCC 		2.1 V
Under voltage lockout (falling) 2 V
START-UP CIRCUITRY
VPRE Pre-charge voltage SDA, SCL = Hi-Z 0.8 1 1.2 V
RISE-TIME ACCELERATORS
IPU RTA pull-up current(2) Position transition on SDA, SCL
VSDA/SCL = 0.6 V, Slew rate = 1.25 V/µs. VCC = 3.3 V		 2 5 mA
INPUT-OUTPUT CONNECTION
ILI Input pin leakage SDA/SCL pins = 90% VCC, EN = VCC, GND
SDA/SCL pins = 10% VCC, EN = GND		 -1 1 µA
VOS Input-output offset voltage (SCLIN to SCLOUT, SCLOUT to SCLIN and SDAIN to SDAOUT, SDAOUT to SDAIN RPU for SDA/SCL = 10 kΩ 60 100 mV
II_RDY Ready pin leakage EN = VCC, READY = VCC, Bus connected -1 1 µA
DIGITAL IO THRESHOLD
VIH High-level input voltage EN 0.7 × VCC VCC V
VIL Low-level input voltage EN 0 0.3 × VCC
VOL Low-level output voltage SDAIN, SCLIN, SDAOUT, SCLOUT
IOL = 4 mA
VIN = 0.1 V		 0.15 0.4
READY
IOL = 3 mA		 0 0.4
DYNAMIC CHARACTERISTICS
CIN (EN) EN input capacitance VEN = 0 V or VCC
f = 400 kHz		 1.6 4 pF
CIO (READY) READY output capacitance VREADY = 0 V or VCC
f = 400 kHz		 7 10
CIO (SDA/SCL) SDA/SCL pin capacitance VPIN = 0 V or VCC
f = 400 kHz		 5 10
(1) In shutdown mode there will also be current flowing from VCC through the ready pin as this pin is pulled down to indicate the bus is disconnected.
(2) Determined by design, not tested in production.