SFFS079A June   2021  – October 2023 TPD3S713-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPD3S713-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TPD3S713-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPD3S713-Q1 data sheet.

GUID-E78A8F5D-7CE3-42D9-9009-7418ECDF4FD2-low.gifFigure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Device used within the 'Recommended Operating Conditions' and the 'Absolute Maximum Ratings' found in the appropriate device data sheet.

  • Configuration as shown in the 'Example Application Circuit' found in the appropriate device data sheet.

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IMON 1 Loss of current monitor functionality, device can't sense the current. C
IN 2 Device will not operate. No BUS output voltage. B
IN 3 Device will not operate. No BUS output voltage. B
DM_OUT 4 Device can't communicate with host and attached device. B
DP_OUT 5 Device can't communicate with host and attached device. B
CS 6 Loss of 'Linear cable compensation current' functionality. C
EN 7 Loss of ENABLE functionality. Device will remain in shut-down mode. B
ILIM_SEL 8 ILIM_LO resistor is valid, not any function will be impacted. C
INT1 9 Device can‘t enter into the normal mode. B
INT2 10 No effect. D
GND 11 No effect. D
BIAS 12 Device can't communicate with host and attached device. B
DP_IN 13 Device can't communicate with host and attached device. B
DM_IN 14 Device can't communicate with host and attached device. B
BUS 15 Device hiccups and under current limitted status. B
BUS 16 Device hiccups and under current limitted status. B
NC 17 No effect. D
/FAULT 18 Loss of /FAULT functionality, device always appears to be in the fault condition. C
ILIM_LO 19 Device will have the max current limit value at 1.15A TYP. C
ILIM_HI 20 Device will have the max current limit value at 1.15A TYP. C
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
IMON1Loss of current monitor functionality, device can't sense the current.C
IN2Long-term reliability may impact due to lower bonding-wire count.C
IN3Long-term reliability may impact due to lower bonding-wire count.C
DM_OUT4Device can't communicate with host and attached device.B
DP_OUT5Device can't communicate with host and attached device.B
CS6Loss of 'Linear cable compensation current' functionality.C
EN7Device enable status is uncertain and can't be controlled.B
ILIM_SEL8ILIM_HI/LO selection is uncertain and can't be controlled.C
INT19Device operating mode is uncertain and can't be controlled.C
INT210BUS OVP threshold is uncertain between 6V and 6.95V.C
GND11Device remains unpowered.B
BIAS12Affect the IEC ESD performance.C
DP_IN13Device can't communicate with host and attached device.B
DM_IN14Device can't communicate with host and attached device.B
BUS15Long-term reliability may impact due to lower bonding-wire count.C
BUS16Long-term reliability may impact due to lower bonding-wire count.C
NC17No effect.D
/FAULT18Loss of /FAULT functionality.C
ILIM_LO19No effect if ILIM_SEL is high, otherwise current limit value is close to 0, and device is in current limit status.B
ILIM_HI20No effect if ILIM_SEL is low, otherwise current limit value is close to 0, and device is in current limit status.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
IMON1INLoss of current monitor functionality, device can't sense the current.C
IN2INNo effect.D
IN3DM_OUTDevice can't communicate with host and attached device.B
DM_OUT4DP_OUTDevice can't communicate with host and attached device.B
DP_OUT5CSDevice can't communicate with host and attached device, and loss of 'Linear cable compensation current' functionality.B
CS6ENLoss of 'Linear cable compensation current' functionality, and device enable status is uncertain and can't be controlled.B
EN7ILIM_SEL ILIM_SEL high/low and device off/on depend on how EN and ILIM_SEL circuits interact.B
ILIM_SEL8INT1 ILIM_SEL high/low and device operating mode depend on how ILIM_SEL and INT1 circuits interact.B
INT19INT2Device operating mode and BUS OVP threshold depend on how INT1 and INT2 circuits interact.B
INT210GNDNo effect.D
GND11BIASDevice can't communicate with host and attached device.B
BIAS12DP_INDevice can't communicate with host and attached device.B
DP_IN13DM_INDevice can't communicate with host and attached device.B
DM_IN14BUSDevice enter into DM_IN OVP, and can't communicate with host and attached device.B
BUS15BUSNo effect.D
BUS16NCNC pin is open-drain structure, if NC pin is trigged, BUS will be shortted to ground.B
NC17/FAULTNC pin is open-drain structure, if NC pin is trigged, /FAULT will be shortted to ground.C
/FAULT18ILIM_LOLoss of /FAULT functionality, current limit value is impacted.B
ILIM_LO19ILIM_HICurrent limit value is impacted.C
ILIM_HI20IMONLoss of current monitor functionality, current limit value is impacted.C
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IMON 1 Loss of current monitor functionality, device can't sense the current. C
IN 2 No effect. D
IN 3 No effect. D
DM_OUT 4 Device can't communicate with host and attached device. B
DP_OUT 5 Device can't communicate with host and attached device. B
CS 6 Loss of 'Linear cable compensation current' functionality. C
EN 7 Device is always enabled. C
ILIM_SEL 8 ILIM_HI is always selected. C
INT1 9 Device is always in normal mode. C
INT2 10 BUS OVP threshold is 6.95V. C
GND 11 Former power supply may be pulled down, device is unpowered. B
BIAS 12 Affect the IEC ESD performance. C
DP_IN 13 Device enter into DP_IN OVP, it can't communicate with host and attached device. B
DM_IN 14 Device enter into DM_IN OVP, it can't communicate with host and attached device. B
BUS 15 Power switch will be bypassed. B
BUS 16 Power switch will be bypassed. B
NC 17 No effect. D
/FAULT 18 Loss of /FAULT functionality, can't check whether the device is in the fault condition. C
ILIM_LO 19 No effect if ILIM_SEL is high, otherwise current limit value is close to 0, and device is in current limit status. B
ILIM_HI 20 No effect if ILIM_SEL is low, otherwise current limit value is close to 0, and device is in current limit status. B