SFFS191A March   2022  – October 2024 UCC27211A-Q1 , UCC27212A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (Power Pad) Package
    2. 2.2 SOIC Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

1 Overview

This document contains information for UCC27211A-Q1 and UCC27212A-Q1 (SOIC (Power Pad) package) and UCC27211A-Q1 (SOIC package) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

UCC27211A-Q1 UCC27212A-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

UCC27211A-Q1 and UCC27212A-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.