SFFS819 May   2024 RES11A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1  SOT-23-THIN Package: RES11A10-Q1
    2. 2.2  SOT-23-THIN Package: RES11A15-Q1
    3. 2.3  SOT-23-THIN Package: RES11A16-Q1
    4. 2.4  SOT-23-THIN Package: RES11A20-Q1
    5. 2.5  SOT-23-THIN Package: RES11A25-Q1
    6. 2.6  SOT-23-THIN Package: RES11A30-Q1
    7. 2.7  SOT-23-THIN Package: RES11A40-Q1
    8. 2.8  SOT-23-THIN Package: RES11A50-Q1
    9. 2.9  SOT-23-THIN Package: RES11A90-Q1
    10. 2.10 SOT-23-THIN Package: RES11A00-Q1
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

2.4 SOT-23-THIN Package: RES11A20-Q1

This section provides functional safety failure in time (FIT) rates for the SOT-23-THIN package of the RES11A20-Q1 based on two different industry-wide used reliability standards:

  • Table 2-19 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-20 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-7 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
100% of Rated Power 80% 60% 40% 20%
Total component FIT rate 7 6 6 6 5
Die FIT rate 5 4 4 4 3
Package FIT rate 2 2 2 2 2

The failure rate and mission profile information in Table 2-19 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11
  • Power dissipation: 134 mW (100% of maximum rated power)
  • Climate type: World-wide table 8
  • Package factor (lambda 3): Table 17b
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-8 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS
Digital, analog, or mixed		 20 FIT 55°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-20 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.