SFFS979 August 2024 TSD5402-Q1
This section provides functional safety failure in time (FIT) rates for TSD5402-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total component FIT rate | 13 |
Die FIT rate | 4 |
Package FIT rate | 9 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS/BICMOS ASICs Analog and Mixed =<50V supply | 25 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.