SGLS164A April   2003  – October 2024 UC2842AQ , UC2843AQ , UC2845AQ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Electrical Characteristics
    4. 5.4 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
VCC voltage (low impedance source) 30 V
VCC voltage (ICC mA) self limiting
Output current IO ±1 A
Output energy (capacitive load) 5 µJ
Analog Inputs (pins 3, 5) –0.3 6.3 V
Error Amp Output Sink current 10 mA
Power Dissipation at TA < +25°C (D package) 1 W
Package thermal impedance: D (8-pin) package θJA (see (3)): Typical 117.4 °C/W
Storage temperature range Tstg –65 150 °C
Lead temperature soldering 1.6 mm (1/16 inch) from case for 10 seconds 300 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals.
(3) Long term high–temperature storage and/or extended use at maximum recommended operating conditions can result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.