SLAA934A December 2019 – December 2024 TPS732-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TPS732-Q1 (SOT-223 (DCQ), VSON (DRB), and SOT-23 (DBV) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2, Table 4-10, and Table 4-10)
Pin open-circuited (see Table 4-3, Table 4-11, and Table 4-11)
Pin short-circuited to an adjacent pin (see Table 4-4, Table 4-12, and Table 4-12)
Pin short-circuited to supply (see Table 4-5, Table 4-13, and Table 4-13)

Table 4-5 through Table 4-13 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Device operates at free-air temperatures between -40°C and 150°C
Device operates at an input voltage of at least 1.7V and no more than 5.5V
Device operates according to all recommended operating conditions and does not exceed the absolute maximum ratings