SLLA502A October 2020 – December 2021 TCAN1042-Q1 , TCAN1042G-Q1 , TCAN1042GV-Q1 , TCAN1042H-Q1 , TCAN1042HG-Q1 , TCAN1042HGV-Q1 , TCAN1042HV-Q1 , TCAN1042V-Q1
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This document contains information for TCAN1042-Q1 and TCAN1042V-Q1 (as well as the TCAN1042H-Q1, TCAN1042G-Q1, TCAN1042HV-Q1, TCAN1042GV-Q1, TCAN1042HG-Q1 and TCAN1042HGV-Q1). These are Controller Area Network (CAN) transceivers in the SOIC (D) and VSON (DRB) packages to aid in a functional safety system design. Information provided are:
TCAN1042-Q1 and TCAN1042V-Q1 were developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for TCAN1042-Q1 and TCAN1042V-Q1 (as well as the TCAN1042H-Q1, TCAN1042G-Q1, TCAN1042HV-Q1, TCAN1042GV-Q1, TCAN1042HG-Q1 and TCAN1042HGV-Q1) based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) 8-pin SOIC (D) | FIT (Failures Per 109 Hours) 8-pin VSON (DRB) |
---|---|---|
Total Component FIT Rate | 12 | 6 |
Die FIT Rate | 4 | 2 |
Package FIT Rate | 8 | 4 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS, BICMOS ASICs Analog & Mixed =<50V supply | 20 FIT | 55C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for TCAN1042-Q1 and TCAN1042V-Q1 (as well as the TCAN1042H-Q1, TCAN1042G-Q1, TCAN1042HV-Q1, TCAN1042GV-Q1, TCAN1042HG-Q1 and TCAN1042HGV-Q1) in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
Receiver fail | 45% |
Transmitter fail | 45% |
CANL or CANH driver stuck dominant | 5% |
Short circuitry any two pins | 5% |
This section provides a Failure Mode Analysis (FMA) for the pins of the TCAN1042-Q1 and TCAN1042V-Q1 (as well as the TCAN1042H-Q1, TCAN1042G-Q1, TCAN1042HV-Q1, TCAN1042GV-Q1, TCAN1042HG-Q1 and TCAN1042HGV-Q1). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-7 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TCAN1042-Q1/TCAN1042V-Q1 SOIC pin diagram. Figure 4-2 shows the TCAN1042-Q1/TCAN1042V-Q1 VSON pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TCAN1042-Q1/TCAN1042V-Q1 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | Device will enter dominant time out mode. Unable to transmit data. | B |
GND | 2 | None | D |
VCC | 3 | Device unpowered, high ICC current. | B |
RXD | 4 | Transceiver output biased dominant, unable to receive data from the CAN bus. Internal damage possible. | B |
NC | 5 | None | D |
VIO | 5 | Device will be in protected mode. Transceiver passive on bus. | B |
CANL | 6 | VO(REC) spec violated. Degraded EMC performance. | C |
CANH | 7 | Device cannot drive dominant to the bus, no communication possible. | B |
STB | 8 | STB stuck low, transceiver unable to enter low-power mode. | B |
Thermal Pad | - | None | D |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | TXD pin defaults high, device always recessive and unable to transmit data. | B |
GND | 2 | Device unpowered. | B |
VCC | 3 | Device unpowered. | B |
RXD | 4 | No RXD output, unable to receive data. | B |
NC | 5 | None | D |
VIO | 5 | Device will be in protected mode. Transceiver passive on bus. | B |
CANL | 6 | Device cannot drive dominant on the bus, unable to communicate. | B |
CANH | 7 | Device cannot drive dominant on the bus, unable to communicate. | B |
STB | 8 | STB pin defaults high, transceiver stuck in low-power mode. | B |
Thermal Pad | - | None | D |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|---|
TXD | 1 | GND | Device will enter dominant time out mode. Unable to transmit data. | B |
GND | 2 | VCC | Device unpowered, high ICC current. | B |
VCC | 3 | RXD | RXD output stuck high, unable to receive data. | B |
NC | 5 | CANL | None | D |
VIO | 5 | CANL | Bus stuck recessive, no communication possible. IOS current may be reached on CANL. | B |
CANL | 6 | CANH | Bus stuck recessive, no communication possible. IOS current may be reached on CANH/CANL. | B |
CANH | 7 | STB | Driver and receiver turn off when a dominant is driven. May not enter normal mode. | B |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | TXD stuck high, unable to transmit data. | B |
GND | 2 | Device unpowered, high ICC current. | B |
VCC | 3 | None | D |
RXD | 4 | RXD pin stuck high, unable to receive data. | B |
NC | 5 | None | D |
VIO | 5 | IO pins will operate as 5V input/outputs. Microcontroller may be damaged if VCC > VIO. | C |
CANL | 6 | RXD always recessive, no communication possible. IOS current may be reached. | B |
CANH | 7 | VO(REC) spec violated, degraded EMC performance. | C |
STB | 8 | STB stuck high, transceiver always in standby mode. | B |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | Absolute maximum violation, transceiver may be damaged. Unable to transmit data. | A |
GND | 2 | Device unpowered, high IBATcurrent | B |
VCC | 3 | Absolute maximum violation, transceiver may be damaged. Bus may be unable to communicate. | A |
RXD | 4 | Absolute maximum violation, transceiver may be damaged. Unable to receive data. | A |
NC | 5 | None | D |
VIO | 5 | Absolute maximum violation, transceiver may be damaged. | A |
CANL | 6 | RXD always recessive, no communication possible. IOScurrent may be reached. | B |
CANH | 7 | VO(REC) spec violated, degraded EMC performance. | C |
STB | 8 | Absolute maximum violation, transceiver may be damaged. Transceiver stuck in low-power mode. | A |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | TXD stuck high, unable to transmit data. | B |
GND | 2 | Device unpowered, high IIO current. | B |
VCC | 3 | IO pins will operate as 5V input/outputs. Microcontroller may be damaged if VCC > VIO. | C |
RXD | 4 | RXD pin stuck high, unable to receive data. | B |
NC | 5 | None | D |
VIO | 5 | None | D |
CANL | 6 | RXD always recessive, no communication possible. IOS current may be reached if VIO ≥ 3.3V. | B |
CANH | 7 | VO(REC) spec violated if, degraded EMC performance. | C |
STB | 8 | STB stuck high, transceiver always in standby mode. | B |