SLLA621A September   2023  – October 2023 MCF8315A , MCF8316A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Design Challenge 1: Thermal Challenges
    1. 2.1 Causes of Thermal Issues
    2. 2.2 How to Solve Thermal Issues
      1. 2.2.1 Solve the Thermal Problem From Hardware
      2. 2.2.2 Solve the Thermal Problem from Algorithm
        1. 2.2.2.1 MCF8315 Test 1
        2. 2.2.2.2 MCF8315 Test 2
        3. 2.2.2.3 MCF8316 Test 1
        4. 2.2.2.4 MCF8316 Test 2
      3. 2.2.3 Solve the Thermal Challenges From PCB Layout
  6. 3Design Challenge 2: Quick Startup
    1. 3.1 Causes of Quick Startup Issues
    2. 3.2 How to Solve Quick Startup Issues
  7. 4Summary
    1. 4.1 Acknowledgment
  8. 5References
  9. 6Revision History

2.1 Causes of Thermal Issues

The first step is to analyze which factors can cause thermal challenges for MCF831x, starting with hardware, layout, and algorithm, respectively:

  1. Hardware
    From the hardware point of view, the heat sources of MCF831x are mainly divided into the following points.
    • The conduction and switching loss of the internal MOSFET
    • The loss on the sampling resistor
    • The loss generated by the internal LDO/BUCK.
  2. Algorithms
    Due to the FOC control method used by MCF831x, the efficiency is relatively high, but the PWM frequency, accuracy of current sampling, and accuracy of the observer's observation angle also affect the efficiency. Correct configuration is conducive to better thermal performance.
  3. PCB Layout
    This is an easily overlooked factor in PCB design. In fact, the temperature difference between a good layout and a poor layout can be as high as 10°C during the test!