SLLS350Q April   1999  – August 2024 MAX3243

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics –– Auto Power Down
    6. 5.6  Electrical Characteristics –– Driver
    7. 5.7  Electrical Characteristics –– Receiver
    8. 5.8  Switching Characteristics –– Auto Power Down
    9. 5.9  Switching Characteristics –– Driver
    10. 5.10 Switching Characteristics –– Receiver
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Auto-Power-Down
      2. 7.3.2 Charge Pump
      3. 7.3.3 RS232 Driver
      4. 7.3.4 RS232 Receiver
      5. 7.3.5 ROUT2B Receiver
      6. 7.3.6 Invalid Input Detection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.9 Switching Characteristics –– Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 8-1) MAX3243C, MAX3243I
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
Maximum data rateRL = 3 kΩ
One DOUT switching,		CL = 1000 pF
See Figure 6-1		150250kbit/s
tsk(p)Pulse skew(3)RL = 3 kΩ to 7 kΩCL = 150 pF to 2500 pF
See Figure 6-3		100ns
SR(tr)Slew rate, transition region
(see Figure 6-1)		VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ		CL = 150 pF to 1000 pF630V/μs
CL = 150 pF to 2500 pF430
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(2) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.