SLLSEQ7E December   2015  – December 2019 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
    8. 8.8 Typical Characteristics, TCAN330 Receiver
    9. 8.9 Typical Characteristics, TCAN330 Driver
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 TXD Dominant Timeout (TXD DTO)
      2. 10.3.2 RXD Dominant Timeout (RXD DTO)
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Undervoltage Lockout and Unpowered Device
      5. 10.3.5 Fault Pin (TCAN337)
      6. 10.3.6 Floating Pins
      7. 10.3.7 CAN Bus Short Circuit Current Limiting
      8. 10.3.8 ESD Protection
      9. 10.3.9 Digital Inputs and Outputs
    4. 10.4 Device Functional Modes
      1. 10.4.1 CAN Bus States
      2. 10.4.2 Normal Mode
      3. 10.4.3 Silent Mode
      4. 10.4.4 Standby Mode with Wake
      5. 10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 10.4.6 Shutdown Mode
      7. 10.4.7 Driver and Receiver Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Bus Loading, Length and Number of Nodes
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
      1. 11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
      2. 11.3.2 Differential Signal
      3. 11.3.3 Common-Mode Signal and EMC Performance
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

13.1 Layout Guidelines

TCAN33x family of devices incorporates integrated IEC 61000-4-2 ESD protection. Should the system requires additional protection against ESD, EFT or surge, additional external protection and filtering circuitry may be needed.

In order for the PCB design to be successful, start with design of the protection and filtering circuitry. Because ESD and EFT transients have a wide frequency bandwidth from approximately 3 MHz to 3 GHz, high frequency layout techniques must be applied during PCB design.

Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Below is a list of layout recommendations when designing a CAN transceiver into an application.

  • Transient Protection on CANH and CANL: Transient Voltage Suppression (TVS) and capacitors (D1, C5 and C7 shown in Figure 40) can be used for additional system level protection. These devices must be placed as close to the connector as possible. This prevents the transient energy and noise from penetrating into other nets on the board.
  • Bus Termination on CANH and CANL: Figure 40 shows split termination where the termination is split into two resistors, R5 and R6, with the center or split tap of the termination connected to ground through capacitor C6. Split termination provides common mode filtering for the bus. When termination is placed on the board instead of directly on the bus, care must be taken to ensure the terminating node is not removed from the bus, as this causes signal integrity issues if the bus is not properly terminated on both ends.
  • Decoupling Capacitors on VCC: Bypass and bulk capacitors must be placed as close as possible to the supply pins of transceiver (examples are C2 and C3).
  • Ground and power connections: Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.
  • Digital inputs and outputs: To limit current of digital lines, serial resistors may be used. Examples are R1, R2, R3 and R4.
  • Filtering noise on digital inputs and outputs: To filter noise on the digital I/O lines, a capacitor may be used close to the input side of the I/O as shown by C1, C8 and C4.
  • Fault Output Pin (TCAN337 only): Because the FAULT output pin is an open drain output, an external pullup resistor is required to pull the pin voltage high for normal operation (R7).
  • TXD input pin: If an open-drain host processor is used to drive the TXD pin of the device, an external pullup resistor between 1 kΩ and 10 kΩ must be used to help drive the recessive input state of the device (weak internal pullup resistor).