SLLSFC5C November   2021  – January 2023 ISOUSB211

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Test Circuits
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Supply Options
      2. 8.3.2  Power Up
      3. 8.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4  Connect and Speed Detection
      5. 8.3.5  Disconnect Detection
      6. 8.3.6  Reset
      7. 8.3.7  LS/FS Message Traffic
      8. 8.3.8  HS Message Traffic
      9. 8.3.9  Equalization and Pre-emphasis
      10. 8.3.10 L2 Power Management State (Suspend) and Resume
      11. 8.3.11 L1 Power Management State (Sleep) and Resume
      12. 8.3.12 HS Test Mode Support
      13. 8.3.13 CDP Advertising
    4. 8.4 Device Functional Modes
  10. Power Supply Recommendations
  11. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
    2. 10.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 10.3 Thermal Considerations
      1. 10.3.1 VBUS / V3P3V Power
      2. 10.3.2 VCCx / V1P8Vx Power
      3. 10.3.3 Example Configuration 1
      4. 10.3.4 Example Configuration 2
      5. 10.3.5 Example Configuration 3
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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