SLLSFJ0F January   2020  – February 2023 ISO6720 , ISO6721 , ISO6721R

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Electrical Characteristics—1.8-V Supply
    16. 6.16 Supply Current Characteristics—1.8-V Supply
    17. 6.17 Switching Characteristics—5-V Supply
    18. 6.18 Switching Characteristics—3.3-V Supply
    19. 6.19 Switching Characteristics—2.5-V Supply
    20. 6.20 Switching Characteristics—1.8-V Supply
    21. 6.21 Insulation Characteristics Curves
    22. 6.22 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Insulation Lifetime

Insulation lifetime projection data is collected by using industry-standard Time Dependent Dielectric Breakdown (TDDB) test method. In this test, all pins on each side of the barrier are tied together creating a two-terminal device and high voltage applied between the two sides; See #T4174073-11 for TDDB test setup. The insulation breakdown data is collected at various high voltages switching at 60 Hz over temperature. For basic insulation, VDE standard requires the use of TDDB projection line with failure rate of less than 1000 part per million (ppm). For reinforced insulation, VDE standard requires the use of TDDB projection line with failure rate of less than 1 part per million (ppm).

Even though the expected minimum insulation lifetime is 20 years, at the specified working isolation voltage, VDE basic and reinforced certifications require additional safety margin of 20% for working voltage. For basic certification, device lifetime requires a safety margin of 20% translating to a minimum required insulation lifetime of 24 years at a working voltage that is 20% higher than the specified value.

#T4174073-12 shows the intrinsic capability of the isolation barrier to withstand high voltage stress over its lifetime. Based on the TDDB data, the intrinsic capability of the insulation is 450 VRMS with a lifetime of >100 years in the 8D package . Other factors, such as package size, pollution degree, material group, etc. can further limit the working voltage of the component. At the lower working voltages, the corresponding insulation lifetime is much longer than 100 years in the 8-D package.

GUID-10B70A5D-5BD1-41CE-BC33-46C923D478D2-low.gifFigure 9-7 Test Setup for Insulation Lifetime Measurement
Figure 9-8 Insulation Lifetime Projection Data for 8-D Package