SLLSG24 November   2024 TCAN2845-Q1 , TCAN2847-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Pin Configuration and Functions
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 CAN Transceiver Physical Layer Standards:
      2. 6.1.2 LIN Transceiver Physical Layer Standards
      3. 6.1.3 EMC Requirements:
      4. 6.1.4 Conformance Test Requirements:
      5. 6.1.5 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Tape and Reel Information
    2. 8.2 Mechanical Data

5 Pin Configuration and Functions

TCAN2845-Q1 TCAN2847-Q1 RHB Package, 32 Pin (QFN) Top ViewFigure 5-1 RHB Package, 32 Pin (QFN)
Top View
Table 5-1 Pin Functions RHB Package
NO.PINTYPEDESCRIPTION
TCAN2845-Q1TCAN2847-Q1
1WAKE2WAKE2high voltageLocal wake input terminal, high voltage capable
2WAKE1WAKE1high voltageLocal wake input terminal, high voltage capable
3LIMPLIMPhigh voltageLimp home output (Active low; open-drain output)
4HSS4HSS4high voltageHigh side switch
5HSS3HSS3high voltageHigh side switch
6HSS2HSS2high voltageHigh side switch
7HSS1HSS1high voltageHigh side switch
8VHSSVHSSpowerHigh side switch power
9VSUPVSUPhigh voltage powerHigh voltage supply from the battery
10VEXMONVEXMONpowerExternal PNP emitter connection, shunt connection.

Connect to VSUP if external PNP LDO is not used. DO not leave floating.

11VEXCTRLVEXCTRLpowerExternal PNP base control
12VEXCCVEXCCpowerExternal PNP collector connection feedback
13VCC1VCC1powerLDO supply output: 3.3V or 5V
14nRSTnRSTdigitalVCC output monitor pin (active low) and device reset input
15nINTnINTdigitalInterrupt output (active low)
16SWSWdigitalProgramming mode input pin (SPI configurable active high or active low)
17SCKSCKdigitalSPI clock input
18SDISDIdigitalSPI data input
19SDOSDOdigitalSPI data output
20nCSnCSdigitalChip select input (active low)
21NULTXDdigitalLIN transmit data input (low for dominant and high for recessive bus states).
NU is not used and should not be connected to anything.
22NULRXDdigitalLIN receive data output (low for dominant and high for recessive bus states), tri-state.
NU is not used and should not be connected to anything.
23CTXDCTXDdigitalCAN transmit data input (low for dominant and high for recessive bus states).
24CRXDCRXDdigitalCAN receive data output (low for dominant and high for recessive bus states), tri-state.
25GFOGFOdigitalFunction output pin (SPI configurable)
26VCC2VCC2power5V LDO output
27VCANVCANpowerCAN FD transceiver 5V power supply input
28CANHCANHbus I/OHigh level CAN bus I/O line
29 CANLCANLbus I/OLow level CAN bus I/O line
30GNDGNDpowerGround connection: Must be soldered to ground
31NULINhigh voltage I/OLIN bus input/output pin:
NU is not used and should not be connected to anything.
32 WAKE3/DIRWAKE3/DIRhigh voltageLocal wake input terminal, high voltage capable.

Direct drive to control any HSSx when configured

PAD(1)GNDGNDpowerGround connection: Must be soldered to ground
(1) The thermal pad, PAD, is a device ground pin must be soldered to GND