13.1 Layout Guidelines
PCB design is made considering the application, and the review is specific for each system requirements. However, general considerations can optimize the system performance.
- The TLV320AIC3107IRSB thermal pad should be connected to analog output driver ground using multiple VIAS to minimize impedance between the device and ground.
- SPVSS balls of TLV320AIC3107IYZF are recommended to be soldered directly to Class-D ground.
- SPVSS balls of TLV320AIC3107IYZF are recommended to be soldered directly to Class-D ground.
- The TLV320AIC3107 requires the decoupling capacitors to be placed as close as possible to the device power supply terminals.
- If possible, route the differential audio signals differentially on the PCB. This is recommended to get better noise immunity.