The TAS5729MD is a stereo I²S input device which includes a digital auto processor with two-band automatic gain limiting (AGL), digital equalization, course and fine volume control, and PWM level meter. The AGL is an enhanced dynamic range compression (DRC) function. The device can operate from a wide PVDD power supply range to enable use in numerous applications. The TAS5729MD operates with a nominal supply voltage from 4.5 to 24 VDC. The device is controlled by an I²C control port. The device has an integrated DirectPath™ headphone amplifier and line driver to increase system-level integration and reduce total solution costs.
An optimal mix of thermal performance and device cost is provided in the 200-mΩ RDS(ON) of the output MOSFETs. Additionally, a thermally enhanced HTSSOP provides excellent operation in the elevated ambient temperatures found in today's modern consumer electronic devices.
The entire TAS5729xx family is pin-to-pin compatible allowing a single hardware solution to be used across several end application platforms. Additionally, the I²C register map in the entire TAS5729xx family is identical to ensure low development overhead to choose between devices based upon system level requirements.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TAS5729MD | HTSSOP (48) | 12.50 mm × 6.10 mm |
NOTE:
Dashed lines represent thermally limited region.Changes from D Revision (January 2016) to E Revision
Changes from C Revision (March 2015) to D Revision
Changes from B Revision (September 2014) to C Revision
Changes from A Revision (June 2013) to B Revision
DEVICE NAME | DESCRIPTION |
---|---|
TAS5729MD | 12-W I²S Input Class-D Amplifier with Digital Audio Processor and DirectPath HP and Line Driver |
TAS5707 | 20-W Stereo I2S Audio Power Amplifier with Speaker EQ and DRC |
TAS5721 | 15-W Stereo (2.1) Class-D Audio Amp with Integrated HP Amplifier Audio Processing |
PIN | TYPE(1) | TERMINATION | DESCRIPTION | |
---|---|---|---|---|
NAME | NUMBER | |||
ADR/SPK_FAULT | 20 | DI/DO | — | Dual-function pin which sets the LSB of the 7-bit I2C address to 0 if pulled to GND, 1 if pulled to DVDD. If configured to be a fault output via the System Control Register 2 (0x05), this pin is pulled low when an internal fault with the speaker amplifier occurs. A pullup or pulldown resistor is required, as is shown in the Typical Applications. |
AGND | 36 | P | — | Ground for analog circuitry(3) |
AVDD | 19 | P | — | Power supply for internal analog circuitry |
ANA_REG1 | 18 | P | — | Linear voltage regulator output derived from AVDD supply which is used for internal analog circuitry. Nominal 1.8-V output.(2) |
ANA_REG2 | 37 | P | — | Linear voltage regulator output derived from AVDD supply which is used for internal analog circuitry. Nominal 3.3-V output.(2) |
BSTRPx | 3, 42, 46, 47 | P | — | Connection points for the bootstrap capacitors which are used to create a power supply for the high-side gate drive of the device. |
DGND | 35 | P | — | Ground for digital circuitry(3) |
DIG_REG | 24 | P | — | Linear voltage regulator output derived from the DVDD supply which is used for internal digital circuitry.(2) |
DR_CN | 12 | P | — | Negative pin for capacitor connection used in headphone amplifier and line driver charge pump |
DR_CP | 13 | P | — | Positive pin for capacitor connection used in headphone amplifier and line driver charge pump |
DR_INx | 7, 10 | AI | — | Input for channel A or B of headphone amplifier or line driver |
DR_OUTx | 8, 9 | AO | — | Output for channel A or B of headphone amplifier or line driver |
DR_SDI | 39 | DI | — | Places the headphone amplifier/line driver in shutdown when pulled low. |
DRVSS | 11 | P | — | Negative supply generated by charge pump for ground centered headphone and line driver output |
DRVDD | 14 | P | — | Power supply for internal headphone and line driver circuitry |
DVDD | 34 | P | — | Power supply for the internal digital circuitry |
GVDD_REG | 40 | P | — | Voltage regulator derived from PVDD supply(2) |
LRCLK | 26 | DI | Pulldown | Word select clock of the serial audio port. |
MCLK | 21 | DI | Pulldown | Master clock used for internal clock tree and sub-circuit and state machine clocking |
NC | 31 | — | — | Not connected inside the device (all NC terminals should be connected to ground for optimal thermal performance) |
OSC_GND | 23 | P | — | Ground for oscillator circuitry (this terminal should be connected to the system ground) |
OSC_RES | 22 | AO | — | Connection point for oscillator trim resistor |
PDN | 25 | DI | Pullup | Quick powerdown of the device that is used upon an unexpected loss of the PVDD or DVDD power supply to quickly transition the outputs of the speaker amplifier to Hi-Z. This quick powerdown feature avoids the audible anamolies that would occur as a result of loss of either of the supplies. |
PGND | 1, 44 | P | — | Ground for power device circuitry(3) |
PLL_FLTM | 16 | AI/AO | — | Negative connection point for the PLL loop filter components |
PLL_FLTP | 17 | AI/AO | — | Positive connection point for the PLL loop filter components |
PLL_GND | 15 | P | — | Ground for PLL circuitry (this terminal should be connected to the system ground) |
PowerPAD™ | — | P | — | Thermal and ground pad that provides both an electrical connection to the ground plane and a thermal path to the PCB for heat dissipation. This pad must be grounded to the system ground. (3) |
PVDD | 4, 41 | P | — | Power supply for internal power circuitry |
RST | 32 | DI | Pullup | Places the device in reset when pulled low |
SCL | 30 | DI | — | I2C serial control port clock |
SCLK | 27 | DI | Pulldown | Bit clock of the serial audio port |
SDA | 29 | DI/DO | — | I2C serial control port data |
SDIN | 28 | DI | Pulldown | Data line to the serial data port |
SPK_OUTx | 2, 43, 45, 48 | AO | — | Speaker amplifier outputs |
SSTIMER | 38 | AI | — | Controls ramp time of SPK_OUTx to minimize pop. Leave this pin floating for BD mode. Requires capacitor to GND in AD mode, as is shown in Typical Applications. The capacitor determines the ramp time. |
TEST1 | 5 | DO | — | Used for testing during device production (this terminal must be left floating) |
TEST2 | 6 | DO | — | Used for testing during device production (this terminal must be left floating) |
TEST3 | 33 | DI | — | Used for testing during device production (this terminal must be connected to GND) |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Temperature | Ambient operating temperature, TA | 0 | 85 | °C |
Supply voltage | DVDD, DRVDD, AVDD | –0.3 | 4.2 | V |
PVDD | –0.3 | 30 | V | |
Input voltage | DVDD referenced digital inputs | –0.5 | DVDD + 0.5 | V |
5-V tolerant digital inputs (2) | –0.5 | DVDD + 2.5(3) | V | |
DR_INx | DRVSS – 0.3 | DRVDD + 0.3 | V | |
HP Load | RLOAD(HP) | 12.8 | N/A | Ω |
Line Driver Load | RLOAD(LD) | 600 | N/A | Ω |
Voltage at speaker output pins | SPK_OUTx | –0.03 | 32 | V |
Voltage at BSTRPx pins | BSTRPx | –0.03 | 39 | V |
Storage temperature, Tstg | –40 | 125 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±250 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
TA | Ambient operating temperature | 0 | 85 | °C |
VDD | DVDD, DRVDD, and AVDD supply | 2.97 | 3.63 | V |
PVDD | PVDD supply | 4.5 | 26.4(1) | V |
VIH | Input logic high | 2 | V | |
VIL | Input logic low | 0.8 | V | |
RHP | Minimum HP load | 16 | Ω | |
RLD | Minimum line driver load | 600 | Ω | |
RSPK(BTL) | Minimum speaker load in BTL mode | 4 | Ω | |
RSPK(PBTL) | Minimum speaker load in post-filter PBTL mode | 4 | Ω | |
LFILT | Minimum output inductance under short-circuit condition | 10 | µH |
THERMAL METRIC(1) | TAS5729MD | UNIT | ||
---|---|---|---|---|
DCA(2) | DCA(3) | |||
48 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 62.6 | 32.6 | °C/W |
RθJC(top) | Junction-to-case (bottom) thermal resistance | 17.9 | 16.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.9 | 14.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | 0.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 13.5 | 14.3 | °C/W |
RθJC(bottom) | Junction-to-case (top) thermal resistance | 1.5 | 1.4 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
|IIH| | Input logic high current level | All digital pins | 75 | µA | ||
VIH | Input logic high threshold for DVDD referenced digital inputs | All digital pins | 2 | V | ||
|IIL| | Input logic low current level | All digital pins | 75 | µA | ||
VIL | Input logic low threshold for DVDD referenced digital inputs | All digital pins | 0.8 | V | ||
VOH | Output logic high voltage level | IOH = 4 mA, VDD = 3 V | 2.4 | V | ||
VOL | Output logic low voltage level | IOH = –4 mA, VDD = 3 V | 0.5 | V |
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
DMCLK | Allowable MCLK duty cycle | 40% | 50% | 60% | |
fMCLK | Supported MCLK frequencies | 2.8224 | 24.576 | MHz | |
tr
tf |
Rise or fall time for MCLK | 5 | ns |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
fSCLK | Supported SCLK frequencies | Values include 32, 48, and 64 | 32 | 64 | × fS | |
DSCLK | Allowable SCLK duty cycle | 40% | 50% | 60% | ||
tsu2 | Required SDIN setup time before SCLK rising edge | 10 | ns | |||
th2 | Required SDIN hold time after SCLK rising edge | 10 | ns | |||
fS | Supported input sample rates | 8 | 48 | kHz | ||
DLRCLK | Allowable LRCLK duty cycle | 40% | 50% | 60% | ||
tsu1 | Required LRCLK to SCLK rising edge 10 | ns | ||||
th1 | Required LRCLK to SCLK rising edge | 10 | ns | |||
tr, tf | Rise or fall time for SCLK and LRCLK | 8 | ns | |||
Allowable LRCLK drift before LRCLK reset | 4 | MCLKs |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
OCETHRES | Overcurrent threshold for each BTL output | PVDD = 15 V, TA = 25°C | 4.5 | A | ||
UVETHRES(PVDD) | Undervoltage error (UVE) threshold | PVDD falling | 4 | V | ||
UVETHRES(AVDD) | Undervoltage error (UVE) threshold | AVDD falling | 4.1 | V | ||
UVEHYST(PVDD) | UVE recovery threshold | PVDD rising | 4.5 | V | ||
UVEHYST(AVDD) | UVE recovery threshold | AVDD rising | 2.7 | V | ||
OTETHRES | Overtemperature error (OTE) threshold | 150 | °C | |||
OTEHYST | OTE recovery threshold | 30 | °C |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
fSPK_AMP | Speaker amplifier switching frequency | 11.025-, 22.05-, or 44.1-kHz data rate ±2% | 352.8 | kHz | ||
48-, 24-, 12-, 8-, 16-, or 32-kHz data rate ±2% | 384 | kHz | ||||
RDS(ON) | On resistance of output MOSFET (both high-side and low-side) | PVDD = 15 V, TA = 25°C, die only | 200 | mΩ | ||
PVDD = 15 V, TA = 25°C, includes: die, bond wires, leadframe |
240 | mΩ | ||||
RPD | Internal pulldown resistor at output of each half-bridge making up the full bridge outputs | Connected when drivers are hi-Z to provide bootstrap capacitor charge | 3 | kΩ |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
ICN(SPK) | Idle channel noise | PVDD = 18 V, A-Weighted | 56 | µVrms | ||
PO(SPK) | Maximum continuous output power per channel | PVDD = 13 V, 10% THD, 1-kHz input signal | 10.5 | W | ||
PVDD = 8 V, 10% THD, 1-kHz input signal | 4 | W | ||||
PVDD = 18 V, 10% THD, 1-kHz input signal | 12 | W | ||||
SNR(SPK) | Signal-to-noise ratio (referenced to 0dBFS input signal) | PVDD = 18 V, A-weighted, f = 1 kHz, maximum power at THD < 1% | 105 | dB | ||
THD+N(SPK) | Total harmonic distortion and noise | PVDD = 18 V; PO = 1 W | 0.15% | |||
PVDD = 13 V; PO = 1 W | 0.13% | |||||
PVDD = 8 V; PO = 1 W | 0.2% | |||||
X-Talk(SPK) | Crosstalk (worst case between L-to-R and R-to-L coupling) | PO = 1 W, f = 1 kHz (BD mode) | –70 | dB | ||
PO = 1 W, f = 1 kHz (AD mode) | –48 | dB |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
ICN(SPK) | Idle channel noise | PVDD = 18 V, A-Weighted | 42 | µVrms | ||
PO(SPK) | Maximum continuous output power per channel | PVDD = 13 V, 10% THD, 1-kHz input signal | 18.9 | W | ||
PVDD = 8 V, 10% THD, 1-kHz input signal | 7.2 | W | ||||
PVDD = 18 V, 10% THD, 1-kHz input signal | 24 | W | ||||
SNR(SPK) | Signal-to-noise ratio (referenced to 0dBFS input signal) | PVDD = 18 V, A-weighted, f = 1 kHz, maximum power at THD < 1% | 105 | dB | ||
THD+N(SPK) | Total harmonic distortion and noise | PVDD = 18 V; PO = 1 W | 0.06% | |||
PVDD = 13 V; PO = 1 W | 0.03% | |||||
PVDD = 8 V; PO = 1 W | 0.15% |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
fCP | Charge pump switching frequency | 200 | 300 | 400 | kHz | |
PO(HP) | Headphone amplifier output power | RLOAD(HP) = 32 Ω, THD+N = 1%, outputs in phase | 55 | mW | ||
SNR(HP) | Signal-to-noise ratio | (Referenced to 55-mW output signal), RLOAD(HP) = 32 Ω, A-Weighted | 101 | dB | ||
SNR(LD) | Signal-to-noise ratio | (Referenced to 2-Vrms output signal), RLOAD(LD) = 10 kΩ, A-Weighted | 105 | dB |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
tw(RESET) | Pulse duration required to reset the device | 100 | µs |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
CL(I²C) | Allowable load capacitance for each I2C line | 400 | pF | |||
fSCL | Supported SCL frequency | No wait states | 100 | 400 | kHz | |
tbuf | Bus free time between stop and start conditions | 1.3 | µs | |||
tf(I²C) | Rise time, SCL and SDA | 300 | ns | |||
th1(I²C) | Hold time, SCL to SDA | 0 | ns | |||
th2(I²C) | Hold time, start condition to SCL | 0.6 | µs | |||
tI²C(start) | I2C startup time | Time to enable I2C from RST release | 12 | ms | ||
tr(I²C) | Rise time, SCL and SDA | 300 | ns | |||
tsu1(I²C) | Setup time, SDA to SCL | 100 | ns | |||
tsu2(I²C) | Setup time, SCL to start condition | 0.6 | µs | |||
tsu3(I²C) | Setup time, SCL to stop condition | 0.6 | µs | |||
Tw(H) | Required pulse duration, SCL high | 0.6 | µs | |||
Tw(L) | Required pulse duration, SCL low | 1.3 | µs |
SPEAKER AMPLIFIER STATE | CONFIGURATION SETTINGS | VPVDD
[V] |
IPVDD
[mA] |
IVDD
[mA] |
PDISS
(From all Supplies) [W] |
|
---|---|---|---|---|---|---|
fSPK_AMP | OPERATIONAL STATE | |||||
384kHz | Idle | RST pulled high, speaker amplifier outputs at 50/50 mute | 18 | 20 | 48 | 0.51 |
Reset | RST pulled low, PDN pulled high | 5 | 21 | 0.16 |
NOTE:
Dashed lines represent thermally limited region.