SLUAAJ5 April   2022 TPS565242 , TPS565247 , TPS566242 , TPS566247

 

  1.   Trademarks
  2. 1Introduction
  3. 2Improve Thermal Performance from IC Independently
  4. 3Improve Thermal Performance from PCB Board
  5. 4Thermal Performance
  6. 5Summary
  7. 6References

1 Introduction

With the development of end equipment (EE), there is a strong trend of smaller size, multifunction, and easy-carry. So high density is more and more important, especially for power. TI released a high-power density part TPS566242/7 which can support 6-A continues current with SOT563 package. SOT563 package body size is only 1.6 × 1.2 mm. Up to now, it is the highest power density part of 16-V/6-A. The challenge of high-power density is thermal performance. This application note introduces how TPS566242/7 solve thermal problems from the device itself and the customer’s board.