SLUUD07A June   2024  – September 2024 BQ51013C-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 I/O Descriptions
    2. 2.2 Printed Circuit Board Assembly
    3. 2.3 Best Practices
      1.      15
    4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Related Documentation
  11. 6Revision History

3.2 PCB Layout

The board layout is shown in Figure 3-2 to Figure 3-8.


BQ51013C-Q1EVM Top Overlay

Figure 3-2 Top Overlay

BQ51013C-Q1EVM Top Solder

Figure 3-3 Top Solder

BQ51013C-Q1EVM Top Layer

Figure 3-4 Top Layer

BQ51013C-Q1EVM Bottom Layer

Figure 3-5 Bottom Layer

BQ51013C-Q1EVM Bottom Solder

Figure 3-6 Bottom Solder

BQ51013C-Q1EVM Bottom Overlay

Figure 3-7 Bottom Overlay

BQ51013C-Q1EVM Drill Drawing

Figure 3-8 Drill Drawing