SLUUD07A June   2024  – September 2024 BQ51013C-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 I/O Descriptions
    2. 2.2 Printed Circuit Board Assembly
    3. 2.3 Best Practices
      1.      15
    4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Related Documentation
  11. 6Revision History

2.2 Printed Circuit Board Assembly

The BQ51013C-Q1 EVM PCB contains the BQ51013C-Q1 EVM IC and support circuits. This board contains several jumpers and connectors. R16 provides the option to adjust current limit. EN1 / EN2 can be used to enable / disable the wireless power or AD external power input.

PCB is a two layer board and optimized for evaluation with larger parts and wide spacing. Smaller layout is possible. Power dissipation on the BQ51013C-Q1 can be high and good thermal management is recommended. Large thermal plane and thermal vias.