SLUUD57 October   2024 BQ51013C

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 I/O Descriptions
    2. 2.2 Printed Circuit Board Assembly
    3. 2.3 Best Practices
      1.      15
    4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

3.2 PCB Layout

The board layout is shown in Figure 3-2 to Figure 3-8.


BQ51013CEVM Top Overlay

Figure 3-2 Top Overlay

BQ51013CEVM Top Solder

Figure 3-3 Top Solder

BQ51013CEVM Top Layer

Figure 3-4 Top Layer

BQ51013CEVM Bottom Layer

Figure 3-5 Bottom Layer

BQ51013CEVM Bottom Solder

Figure 3-6 Bottom Solder

BQ51013CEVM Bottom Overlay

Figure 3-7 Bottom Overlay

BQ51013CEVM Drill Drawing

Figure 3-8 Drill Drawing