SLVAE87A December   2020  – October 2023 BQ79600-Q1 , BQ79612-Q1 , BQ79614-Q1 , BQ79616-Q1 , BQ79652-Q1 , BQ79654-Q1 , BQ79656-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 NPN LDO Supply
  5. 2 AVDD, CVDD outputs and DVDD, NEG5, REFHP and REFHM
    1. 2.1 Base Device
    2. 2.2 Design Summary
  6. 3 OTP Programming
  7. 4 Cell Voltage Sense (VCn) and Cell Balancing (CBn)
    1. 4.1 Cell Voltage Sense (VCn)
    2. 4.2 Cell Balancing (CBn)
      1. 4.2.1 Non-Adjacent Cell Balancing
      2. 4.2.2 Adjacent Cell Balancing
      3. 4.2.3 Cell Balancing With External FET
    3. 4.3 Using Fewer Than 16 Cells
      1. 4.3.1 Design Summary
  8. 5 Bus Bar Support
    1. 5.1 Bus Bar on BBP/BBN
    2. 5.2 Typical Connection
      1. 5.2.1 Cell Balancing Handling
    3. 5.3 Bus Bar on Individual VC Channel
    4. 5.4 Multiple Bus Bar Connections
      1. 5.4.1 Two Bus Bar Connections to One Device
      2. 5.4.2 Three Bus Bar Connections to One Device
      3. 5.4.3 Cell Balancing Handling
  9. 6 TSREF
  10. 7 General Purpose Input-Output (GPIO) Configurations
    1. 7.1 Ratiometric Temperature Measurement
    2. 7.2 SPI Mode
      1. 7.2.1 Support 8 NTC Thermistors With SPI Slave Device
      2. 7.2.2 Design Summary
  11. 8 Base and Bridge Device Configuration
    1. 8.1 Power Mode Pings and Tones
      1. 8.1.1 Power Mode Pings
      2. 8.1.2 Power Mode Tones
      3. 8.1.3 Ping and Tone Propagation
    2. 8.2 UART Physical Layer
      1. 8.2.1 Design Considerations
  12. 9 Daisy-Chain Stack Configuration
    1. 9.1 Communication Line Isolation
      1. 9.1.1 Capacitor Only Isolation
      2. 9.1.2 Capacitor and Choke Isolation
      3. 9.1.3 Transformer Isolation
      4. 9.1.4 Design Summary
    2. 9.2 Ring Communication
    3. 9.3 Re-Clocking
      1. 9.3.1 Design Summary
  13. 10Multi-Drop Configuration
  14. 11Main ADC Digital LPF
  15. 12AUX Anti Aliasing Filter (AAF)
  16. 13Layout Guidelines
    1. 13.1 Ground Planes
    2. 13.2 Bypass Capacitors for Power Supplies and References
    3. 13.3 Cell Voltage Sensing
    4. 13.4 Daisy Chain Communication
  17. 14BCI Performance
  18. 15Common and Differential Mode Noise
    1. 15.1 Design Consideration
  19. 16Revision History

9 Daisy-Chain Stack Configuration

In the stacked configuration, the main microcontroller first communicates through a BQ79616-Q1 base device using the UART communications interface. Communication is then relayed up the chain of connected slave BQ79616-Q1 devices using a proprietary differential communications protocol over AC-coupled differential links interconnected by the COMMH± and COMML± pins. A high level diagram of this can be seen in Figure 9-1.

In the case of BQ79616 -Q1 working with a BQ79600-Q1 communication extender, the host microcontroller first communicates through a bridge device by UART or SPI. A command is then moved up the chain of connected slave BQ79616-Q1 devices through COML and COMH pins vertically as described in Figure 9-2.

GUID-98071A2C-5396-4BDF-BCBD-2B85C409BAE3-low.jpg Figure 9-1 Daisy Chain Structure With a Base Device
GUID-60FC5751-89BF-4487-B8F3-7DD71BB5A010-low.jpg Figure 9-2 Daisy Chain Structure With a Bridge Device