SLVAE87A December   2020  – October 2023 BQ79600-Q1 , BQ79612-Q1 , BQ79614-Q1 , BQ79616-Q1 , BQ79652-Q1 , BQ79654-Q1 , BQ79656-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 NPN LDO Supply
  5. 2 AVDD, CVDD outputs and DVDD, NEG5, REFHP and REFHM
    1. 2.1 Base Device
    2. 2.2 Design Summary
  6. 3 OTP Programming
  7. 4 Cell Voltage Sense (VCn) and Cell Balancing (CBn)
    1. 4.1 Cell Voltage Sense (VCn)
    2. 4.2 Cell Balancing (CBn)
      1. 4.2.1 Non-Adjacent Cell Balancing
      2. 4.2.2 Adjacent Cell Balancing
      3. 4.2.3 Cell Balancing With External FET
    3. 4.3 Using Fewer Than 16 Cells
      1. 4.3.1 Design Summary
  8. 5 Bus Bar Support
    1. 5.1 Bus Bar on BBP/BBN
    2. 5.2 Typical Connection
      1. 5.2.1 Cell Balancing Handling
    3. 5.3 Bus Bar on Individual VC Channel
    4. 5.4 Multiple Bus Bar Connections
      1. 5.4.1 Two Bus Bar Connections to One Device
      2. 5.4.2 Three Bus Bar Connections to One Device
      3. 5.4.3 Cell Balancing Handling
  9. 6 TSREF
  10. 7 General Purpose Input-Output (GPIO) Configurations
    1. 7.1 Ratiometric Temperature Measurement
    2. 7.2 SPI Mode
      1. 7.2.1 Support 8 NTC Thermistors With SPI Slave Device
      2. 7.2.2 Design Summary
  11. 8 Base and Bridge Device Configuration
    1. 8.1 Power Mode Pings and Tones
      1. 8.1.1 Power Mode Pings
      2. 8.1.2 Power Mode Tones
      3. 8.1.3 Ping and Tone Propagation
    2. 8.2 UART Physical Layer
      1. 8.2.1 Design Considerations
  12. 9 Daisy-Chain Stack Configuration
    1. 9.1 Communication Line Isolation
      1. 9.1.1 Capacitor Only Isolation
      2. 9.1.2 Capacitor and Choke Isolation
      3. 9.1.3 Transformer Isolation
      4. 9.1.4 Design Summary
    2. 9.2 Ring Communication
    3. 9.3 Re-Clocking
      1. 9.3.1 Design Summary
  13. 10Multi-Drop Configuration
  14. 11Main ADC Digital LPF
  15. 12AUX Anti Aliasing Filter (AAF)
  16. 13Layout Guidelines
    1. 13.1 Ground Planes
    2. 13.2 Bypass Capacitors for Power Supplies and References
    3. 13.3 Cell Voltage Sensing
    4. 13.4 Daisy Chain Communication
  17. 14BCI Performance
  18. 15Common and Differential Mode Noise
    1. 15.1 Design Consideration
  19. 16Revision History

9.1.4 Design Summary

  • For devices located on the same PCB there must be a 2.2-nF isolation capacitor on each COMM± line with a voltage rating twice that of the cell stack.
  • In addition to the isolation method there must be a termination resistor at each end of the connection for devices located on the same PCB and for between PCBs.
  • There are three types of noise isolation methods that can be employed when communicating through a cable:
    1. Capacitor Only Isolation
      1. Only recommended for cables less than 2 m
    2. Capacitor and Choke Isolation
      1. Cables longer than 2 m
      2. Part number: ACT45B-510-2P-TL003 for single mode choke
    3. Transformer Isolation
      1. HMU1228 and HM2147 transformer is recommended
  • PESD2CAN is recommended between communication lines to add ESD isolation
  • Any capacitance present on the communication line can have an effect on the performance. All intentional and parasitic capacitance must be calculated and taken into effect.