This document contains information for TPS4H160-Q1 (HTSSOP package) to aid in a functional safety system design. Information provided are:

• Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

TPS4H160-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

This section provides Functional Safety Failure In Time (FIT) rates for TPS4H160-Q1 based on an industry-wide used reliability standard:

• Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

• Mission Profile: Motor Control from Table 11
• Power dissipation: 500 mW
• Climate type: World-wide Table 8
• Package factor (lambda 3): Table 17b
• Substrate Material: FR4
• EOS FIT rate assumed: 0 FIT