This document contains information for TPS61378-Q1, TPS613781-Q1, TPS613782-Q1, TPS613783-Q1, TPS613784-Q1, TPS613785-Q1(VQFN package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
TPS61378-Q1, TPS613781-Q1, TPS613782-Q1, TPS613783-Q1, TPS613784-Q1, TPS613785-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for TPS61378-Q1, TPS613781-Q1, TPS613782-Q1, TPS613783-Q1, TPS613784-Q1, TPS613785-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate | 14 |
Die FIT Rate | 7 |
Package FIT Rate | 7 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS, BICMOS ASICs Analog & Mixed =<50V supply | 25 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.