SLVAF55 July   2021 TPS62130 , TPS62901 , TPS62902 , TPS62903

 

  1.   Trademarks
  2. 1Introduction
  3. 2Power Density
  4. 3Achieving a Smaller Solution
    1. 3.1 Smaller Package and Fewer External Components
    2. 3.2 Smart Configuration Pin
    3. 3.3 VSET
  5. 4Reducing Power Loss
    1. 4.1 Junction Temperature
    2. 4.2 Automatic Efficiency Enhancement (AEE™)
    3. 4.3 1MHz and 2.5MHz Switching Frequencies
    4. 4.4 Auto PFM/PWM vs. Forced PWM
  6. 5Application Flexibility
    1. 5.1 Quiescent Current
    2. 5.2 Lower and More Accurate Output Voltages
    3. 5.3 Capacitive Discharge
  7. 6Summary
  8. 7References

1 Introduction

Technology is constantly improving – sometimes by leaps and bounds, sometimes by microscopic steps. What is overlooked most of the time, is how those small changes lead to the ground-breaking changes. Each improvement is an improvement on the previous platform – all the way back to the cave men. Today’s achievements stand on the shoulders of those who came before. The same goes for buck converters. The TPS6290x family is the next generation of 17V, low Iq, high efficiency, buck converters that improved upon the previous family TPS621x0. Table 1-1 shows the key features of each product and the improvements on the latest generation family. Each improved feature contributes to the leaps forward in the family. In turn, the improved device, a small part of a design, contributes to ground-breaking advancements in technology. But what does improved really mean? To understand how technology has improved, this application report provides a comparison of the previous version to the new version, as well as an explanation of how the changes benefit the user more than the previous version.

Table 1-1 Feature comparison of TPS621x0 and TPS6290x
FeaturesTPS621x0TPS6290xImprovements
VOUT0.9 V to 6 V0.4 V to 5.5 VSupports lower Vout down to 0.4 V
Typical quiescent current17uA4uA76% lower Iq
FB accuracy (-40°C< TJ <125°C)1.8%<1%44% tighter Vref accuracy
Package size3.0mmx3.0mm QFN1.5mmx2.0mm QFN67% smaller package
Smart configurationNoYesFewer external components needed to configure device
Junction Temperature-40C to 125C-40C to 150CSupports higher Tj up to 150C
Switching Performance2.5MHz2.5MHz and 1MHzProvides Adj Fsw
RDS(ON)120mΩ/50mΩ62mΩ/22mΩLess power loss
Efficiency (12Vin, 1.2Vo, 2.2uH, 1MHz, 3 A)78.8%84%Improved efficiency
Automatic Efficiency EnhancementNoYesHigh efficiency for varying duty cycles
Capacitive dischargeUsing PGUsing Smart ConfigAchieved internally when selected
VSETNoYesThis allows for internal divider that has lower BOM count and better overs systems accuracy